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A novel method to apply thin metal film for preventing footing effect in making micro-mechanical structure on SOI wafer is presented. The handle wafer of the SOI wafer was etched to form cavity by KOH solution, and followed by removing the buried oxide from backside. Then a thin aluminum film was sputtered in the cavity to prevent footing effect. The experimental results showed that the SOI micro-mechanical...
This paper reports a 2nd order electromechanical sigma-delta accelerometer system. Accelerometer is fabricated using dissolved wafer process, and has a structural thickness of 15 mum. A large proof mass is used to decrease the mechanical noise of the accelerometer and 306 fingers per side are used to increase the sensitivity and operation range of the accelerometer. In order to obtain a high resolution,...
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