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This paper reports a micro-gravity MEMS sandwich capacitive accelerometer with symmetrical double-sided folded beam-mass structure. The beam-mass structure is fabricated from a single double-device-layer SOI wafer (D-SOI). The fabrication process produced proof mass with though wafer thickness (860μm) to enable formation of a larger proof mass. The suspension system of eight folded beams with highly...
The paper is dedicated to a cantilever sensor design/fabrication optimization which is related to a no curved structure, before bimolecular functionalization and immobilization. The advantage of cantilever arrays is not only their small size but also their suitability for mass production, which permits economically realistic, disposable sensors. The simulations of the cantilever in the static mode...
A novel method to apply thin metal film for preventing footing effect in making micro-mechanical structure on SOI wafer is presented. The handle wafer of the SOI wafer was etched to form cavity by KOH solution, and followed by removing the buried oxide from backside. Then a thin aluminum film was sputtered in the cavity to prevent footing effect. The experimental results showed that the SOI micro-mechanical...
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