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Higher performance and miniaturization are current trends of electronic equipment, with many devices mounted with a high density on a printed board. The heat density of devices is also increasing. Heat causes various problems in devices, for example, it reduces their processing speed and causes malfunctions. Controlling the thermal resistance of packages is essential for their development. The thermal...
This paper discusses spring-loaded mechanical structures that can be used to make thermal connections between an object to be cooled, such as an integrated circuit, and a dissipative structure, like a cooling plate or heat sink. These metal structures are flexible and resilient, adapting to variations in position and orientation of the two objects to be coupled. Precision experiments demonstrate that...
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