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Because of a rapid growth of worldwide energy consumption an economical use of power is a necessity to ensure the supply reliability. One key technology to realize sparing energy use is power electronics. The cost of power electronic devices became an important aspect in this application due to its broader use compared to the past. In recent years, high efficiency at a given lifetime with low system...
Delamination in semiconductor plastic packages often happens in many interfaces within the package itself, which is mainly caused by coefficient of thermal expansion (C.T.E) mismatch between the interfaces of two materials within the package. Die attach delamination is the separation between the silicon die and die attach pad on leadframe. Die attach delamination will reduce the total area of silicon...
Packages with multiple dies provide additional challenges when documenting their thermal performance. One style of multiple dies packages stacks the die on top of each other with a die attach adhesive. This paper explores the thermal performance of such packages in a wire bond plastic ball grid array package with three different die configurations. The thermal performance of the package was determined...
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