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Low temperature plasma-assisted ALD-grown metal nanocomposite layers based on mixtures of ruthenium and cobalt have been investigated as potential conductive adhesion/barrier layers in thermally restrictive flexible electronics applications. While Ru∶Co metal ratios can be easily adjusted with these processes, initial samples for low thermal budget applications were processed at 200°C with a Ru∶Co...
The study aims at developing a next-generation flip chip (FC) packaging technology that employs a novel anisotropic conductive adhesive (ACF) made of unidirectional Co-nanowire-reinforced polymer nanocomposite, and moreover, exploring the associated process-induced, thermal-mechanical behaviors during bonding process. For carrying out the process simulation, a process-dependent finite element modeling...
Corrosion in Co-Ni-O film, which is adopted as the magnetic layer in metal evaporated tape media, was examined through aging tests, measurements of anode polarized characteristics, and analysis of both chemical bonding by ESCA and of crystallographic characteristics by RHEED. The following results were obtained. 1) The experimental results for exposure tests were strongly correlated with the anode...
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