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For sapphire and various metals (Al alloys, Cu alloys, and stainless steel) bonded at room temperature using Au films, shear strength was assessed in this study. Results show extremely high shear strength of all samples: greater than 10 kN (50 MPa).
Triboelectric nanogenerators (TENG) are developed for wireless and batteryless keyboard applications, using steel-polymer microfabrication methods including lithography, electrochemical etching, hot embossing and thermo-compression bonding. Microfabricated steel electrode and polymer film (polyethylene naphthalate (PEN)) are used for the first time to implement a TENG of conductor-to-dielectric contact-mode...
Based on a simple process referred to as ultimate-thinning-and-transfer-bonding (UTTB), this paper shows that the high-frequency performance of advanced CMOS technologies can be combined with mechanical flexibility and transparency. The invariance upon thinning, transfer and flexure of both DC and RF CMOS electrical characteristics is demonstrated. Specific to high power RF applications, the complete...
Anisotropic conductive films (ACF) has been a key material employed in LCD packaging technologies. The aim is to connect the electrodes in the LCD glass to the IC driver by the trapping conducting particles at the interconnects. One of the main challenges is to control the deformation degree of conducting particles. In this paper we investigate the effect of the bump layout to reduce the squeeze film...
The flip chip package is an advanced chip interconnection technology, which has become a main technology of high density package. This paper mainly studies the influence of bumps deformation in the flip chip bonding process on connection reliability, which provides theoretical reference for the flip bonding process. Bumps deformation is a key factor for the chip reliable connection in the flip chip...
Adoption of Chip-to-Chip (C2C) and Chip-to-Wafer (C2W) thermocompression (TC) flip-chip (FC) bonding in high volume manufacturing of advanced memory modules is accelerating. Advanced memory modules in the form of Wide I/O2, High Bandwidth Memory (HBM) and Hybrid Memory Cubes (HMC) use Through-Silicon Vias (TSVs) and copper pillars to achieve ultra-short chip-to-chip interconnects and the associated...
In plane collective bonding by NCF-TCB with the film inserted between the die and the substrate, which had a significant potential to enhance the productivity, was studied. PTFE and the newly developed film which consisted of thermosetting resin layer were evaluated as the insertion films. The performance of the bonding force leveling was evaluated. Bonding was carried out by the intentionally inclined...
This paper presents buckled nitride thin-film encapsulation using anti-adhesion layer assisted transfer technique and BCB/nitride bilayer wrinkling due to elastic property mismatch between the two attached materials. A 900 nm silicon nitride film is deposited on a Si carrier wafer coated with hydrophobic monolayer and then non-patterned nitride film is directly bonded to BCB sealing rings prepared...
A paste containing CuO particles and polyethylene glycol 1000 as a reducing solvent has been applied to joining pure Cu in electronic applications, and the bondability of the joints and bonding mechanism were investigated. Based on a combination of thermogravimetric and differential thermal analysis, pressurization in the bonding process was determined to be started at temperatures near the exothermal...
This paper describes a handling process for a thin glass panel, 200 mm × 200 mm × 130 (im, through double-side redistribution layer (RDL) formation to enable cost-effective fabrication of through-glass-via (TGV) interposers. The integration scheme includes lamination of a low-temperature bonding material utilizing a lamination process temperature of less than 100°C to bond a thin (130-μm) glass panel...
In this paper, the self-assembly technology is investigated in order to apply on the alignment method to achieve rapid and accurate multichip-to-wafer stacking. By virtue of distinct liquid surface tensions between hydrophilic and hydrophobic materials, the hydrophilic chips can be self-aligned to the hydrophilic substrate which is defined by the surrounding hydrophobic substrate. The surface quality...
0.1 μm soft gold film substrate was ultrasonic bonded with 0.6 mil gold wire, which effectively reduced gold assumption comparing to the traditional 0.3∼0.5 μm soft gold film substrate. The substrate showed good bondability by wire pull test (WPT) and perfect reliability by high temperature storage test (HTST). The bonding structure in failure mode of wire pull test was studied by focused ion beam...
A simple electroless deposition method of fabricating silver nanosheets which is a promising replacement for a high-temperature lead-rich solder used for electronics has been reported. This substrate free deposition method can solve the surface coating problem of the nanostructured silver. By controlling the deposition time, the silver nanosheets with a length of 2μm and a width ranging from 10nm...
The personal electronics market is experiencing rapid growth where smaller electronics carrying more functionality is required. Increasingly, small electronic devices are expected to be incorporated into personal accessories and clothing to make them wearable. This raises great challenges to the substrate technology and related assembly technologies in electronic packaging for high density, small...
A simple electroless deposition method of fabricating silver nanosheets which is a promising replacement for a high-temperature lead-rich solder used for electronics has been reported. This substrate free deposition method can solve the surface coating problem of the nanostructured silver. By controlling the deposition time, the silver nanosheets with a length of 2μm and a width ranging from 10nm...
The personal electronics market is experiencing rapid growth where smaller electronics carrying more functionality is required. Increasingly, small electronic devices are expected to be incorporated into personal accessories and clothing to make them wearable. This raises great challenges to the substrate technology and related assembly technologies in electronic packaging for high density, small...
0.1 μm soft gold film substrate was ultrasonic bonded with 0.6 mil gold wire, which effectively reduced gold assumption comparing to the traditional 0.3∼0.5 μm soft gold film substrate. The substrate showed good bondability by wire pull test (WPT) and perfect reliability by high temperature storage test (HTST). The bonding structure in failure mode of wire pull test was studied by focused ion beam...
Ni/Au microcones were fabricated and thermosonic bonded with Au wire. The thickness of Au film was only 0.05μm. The substrate with Ni/Au microcones showed good Au wire bondability with the average pull strength 4.85 gf and ball shear strength 54.33 gf. Microscopi observation showed that Ni/Au microcones were inserted into Au wire, thus physical interlock between the substrate and Au wire was formed...
The Non-Conductive Film (NCF) for the wafers in 3D and TSV packages has been more and more developed in recent years. In the lamination step in the NCF process, NCF is laminated to a wafer, the wafer with NCF is diced, and an IC chip is bonded to the NCF. This lamination step and the condition after the lamination affect the following steps. In this research, the relation between the composition of...
We investigated the effect of the oxidation-reduction character of metal electrode on the chemical bonding state in metal/Pr-oxide/Ge gate stack structure. The binding energy of the Pr-oxide peak increases with the formation of a metal electrode with the strong reduction character, indicating the change in the valence state of Pr from tetravalent to trivalent. The intensity of the Ge oxide peak changes...
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