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The semiconductor packaging technology trend for electronic products continues to achieve greater miniaturization and higher functionality. Thinner profile chip scale packaging (CSP), such as flip chip CSP (fcCSP), with increasing die complexities is a very important technology for next generation communication devices and internet of things (IoT) applications. Recently, integrated fan out wafer-level...
We report the results of heat transfer analysis of CoW (chip on wafer) process in which IC chips are bonded on a Si wafer by using thermal compression bonding (TCB). The throughput can be remarkably improved because a lot of chips can be pre bonded on a wafer by using non-conductive film (NCF) which is pre-applied adhesive and can be thermally pressed at a time. However, to realize this process, it...
Cu pillar technology can cater for high I/O, fine pitch, and miniaturization requirements compared with wire bonding and conventional solder flip-chip technologies. However, chip–package interaction of Cu pillar and low-$k$ chip is a critical challenge during assembly process due to stiffer Cu pillar structure compared with conventional solder bump. Thermo-compression bonding (TCB) process was adopted...
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