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In this paper, a novel platform technology for integrating radio-frequency microelectromechanical systems (RF-MEMS) and CMOS on a printed circuit board (PCB) is demonstrated. An RF-MEMS switch is constructed on top of a CMOS IC wafer. The stacked structure is subsequently transferred onto a PCB substrate (i.e., FR-4) by thermal compressive bonding, mechanical grinding, and wet removal of bulk silicon...
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