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A faulty interposer in a 2.5-D integrated circuit often results in a hefty loss as the potentially expensive known-good-dies bonded on the interposer will have to be discarded as well. To avoid such a last-minute loss during a multichip integration process, built-in self-repair (BISR) is highly valuable. Even though there have been many BISR schemes in the literature, the proposed method offers a...
Interposer is a critical component in a 2.5-D IC as it serves as a common platform upon which multiple known good dies are bonded. Any defect in an interposer will lead to a loss of compound yield. To avoid such a last-minute yield loss, we propose a timing-aware Built-In Self-Repair method to increase the fault tolerance of high-speed interposer wires. The most unique feature of our method as compared...
Reliability issues concerning integrated systems based on nano-electronic devices have been a matter of research for years. Early focus was on transient fault effects due to particle radiation and failing interconnects due to thermal stress and metal migration. More recently, transistor parameter deterioration due to permanent input voltages at MOS transistor gates has been investigated. One potential...
Due to their reconfigurability and their high density of resources, SRAM-based FPGAs are more and more used in embedded systems. For some applications (Pay-TV,Banking, Telecommunication ...), a high level of security is needed. FPGAs are intrinsically sensitive to ionizing effects, such as light stimulation, and attackers can try to exploit faults injected in the downloaded configuration. Previous...
In this paper, we present a new technique to improve the reliability of H-tree SRAM memories. This technique deals with the SRAM power-bus monitoring by using built-in current sensor (BICS) circuits that detect abnormal current dissipation in the memory power-bus. This abnormal current is the result of a single-event upset (SEU) in the memory and it is generated during the inversion of the state of...
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