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SMA connector is widely used in the high-speed interconnection system. As more designs move toward high-speed serial links with picosecond edge rate, the signal integrity problems caused by the transition structure from SMA connector to the PCB cannot be neglected, especially for precise AFR calibration. To solve this problem, we present four optimization methods, including optimizing the size of...
In the printed circuit board (PCB) of high-speed optical transceiver module, the signal transmission speed is limited by many effects. In a multilayer PCB, a through-hole via is usually used to connect the signal path between the upper-layer and lower-layer. The impedance of signal path in PCB significantly influences on the signal performance. While the impedance of through-hole via mismatches with...
In this paper, a physics based connector model that consists of coaxial lines with different characteristic impedances and lengths is proposed. Method of Moments (MoM) analysis was performed using commercial electromagnetic simulation software, FEKO, for transverse electric and magnetic (TEM) wave propagation through the connector to optimize its physical parameters to fit its measured S parameters.
Electrical Co-design of IC-package-PCB products for Set-Top Box applications has been changing quickly in the past years. The new generation of processors (A53, A57…) is indeed bringing interesting challenges as the business seems to be looking for the most power efficient CPU architectures (DMIPS/W). Moreover standards of high-speed interfaces are being released with increasing speeds (HDMI2.1, USB3...
In underground engineering, the enclosure structure is the most critical part to guarantee the safety of construction. However, defects such as voids or cracks might appear in the structure, which will lead to accidents of foundation pit. In this paper, an improved dipole antenna is designed for detecting enclosure structure defects by a stepped frequency crosshole Ground Penetrating Radar (GPR)....
A transition from vertically launched coaxial connector to routed trace on board is simulated and optimized to achieve very small reflections for precise TRL calibration. The mismatch of the discontinuities in the transition was reduced by controlling the via-impedance, introducing capacitive via-pads and applying diving boards. Each segment was optimized first, and then the whole cascaded structure...
This paper presents the analysis and optimization of the impedance profile of a high speed data (HSD) connector using commercial CEM software. The main method to get information of the impedance along the transmission line for a detailed inspection is the time domain reflectometry (TDR). A basic model will be discussed and the different approaches will be compared on that basis, followed by a concluding...
A new topology distributed power amplifier (DPA) is presented to maximize DC-RF conversion (i.e. for high output). The topology is featured by vectorially combined current sources when loading power transistors into a distributed output and input networks using impedance termination values gathered by device load pull. Broadband impedance transforming filter with Real Frequency Technique (RFT) i s...
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