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A direct high-k/Si gate stack has been proposed for gate oxide scaling. With LaCe-silicate, an EOT of 0.64 nm with an average dielectric constant (kav) of 17.4 has been obtained and an extremely low gate leakage current (Jg) of 0.65 A/cm2. The flatband voltage (Vfb) can be controlled by the compositional ratio of La in the LaCe-silicate layer. Furthermore, incorporation of Ge atom into the silicate...
An aggressive EOT scaling with high-k gate dielectrics has been presented by selection of a rare earth silicate (La, Ce and Pr) as an interfacial layer with La2O3 stacking. Among silicates, La2O3/Ce-silicate nFET has performed a small EOT of 0.51 nm with a reduced gate leakage current of 102 A/cm2. SrO capping further reduces the gate leakage current also with a smaller EOT with improved subthreshold...
Long-channel Ge pMOSFETs and nMOSFETs were fabricated with high-kappa CeO2/HfO2/TiN gate stacks. CeO2 was found to provide effective passivation of the Ge surface, with low diode surface leakage currents. The pMOSFETs showed a large I ON/IOFF ratio of 106, a subthreshold slope of 107 mV/dec, and a peak mobility of approximately 90 cm2 /Vmiddots at 0.25 MV/cm. The nMOSFET performance was compromised...
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