The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The issue of soft error in microelectronics packaging has necessitated the development of low alpha activity solders, as solders are found to be one of the major sources of radiation in electronic devices that causes soft error. Low alpha ray emitter Sn-1.0Ag-0.5Cu (SAC) solders were prepared and their alpha activity was measured using ultra-low background alpha particle counting systems. The solders...
In order to study the effect of nano particles addition to solders on the electro-migration properties, Al doped-Sn58Bi solders were prepared by mechanically dispersing Al particles additive in Sn-58Bi solders. The interfacial morphologies of the plain solder and doped Sn-58Bi solders under a direct current (DC) of 2.5 A at 75°C temperature with Cu pads and Au/Ni/Cu pads on daisy chain type ball grid...
In this study, lead free (Sn-4Ag-0.5Cu (SAC)) and lead (62Sn-36Pb-2Ag (SP)) solder joint on various surface finished of ball grid array (BGA) pad, such as Immersion Tin (ImSn), Organic solderability preservatives (OSPs), Ni-P/Pd/Au (ENEPIG), and Ni-P/Au (ENIG) was investigated by its interface morphology and its physical properties. To evaluate the mechanical and physical properties of BGA pad with...
There is an ongoing demand for low cost high performance RF components for high frequency applications. Current packages for this domain use plastic packages based on wirebonding. The RF performance is limited by parasitic effects due to the RLC network between the wirebond from the dies to the leadframe. One of the best ways to reduce these effects is the use of flip chip technology. Flip chip interconnections...
Au/Ni/Cu under bump metallization (UBM) in tape ball grid array (TBGA) package with Sn-Ag-Cu solder is commonly used for electronic IC packaging due to environmental and business concerns. The drawback of Sn-Ag-Cu solder on selective Ni/Au plating (SMOBC) TBGA is a weakened solder joint, which provides the embrittlement and affects long-terms reliability. The ability of electronic packages and assemblies...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.