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This study describes board-level drop reliability of TFBGA subjected to JEDEC drop test condition which features an impact pulse profile with a peak acceleration of 1500G and a pulse duration of 0.5 ms. The solder ball is assumed as an elastoplastic model, and the other components are assumed to be linear elastic models. Both the global/local finite element method and the finite grid region method...
Thermo-mechanical fatigue and damage has always been an issue for solder joint materials used in micro-electronic devices. Accurate prediction of the damage and crack is essential in order to predict the life of these joints. This paper presents a finite element modeling approach that is used in conjunction with Energy Partitioning Damage Evolution (EPDE) model to determine the state of damage, update...
The scope of the paper is to present the result of the determination of mechanical material properties of a SAC based solder at high strain rates. Miniature bulk specimens which have a diameter comparable to BGA joints are used to investigate the solder behaviour experimentally. Stress and strain data are recorded at high strain rates using a high resolution tensile test setup. Explicit FEM methodology...
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