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Measuring the case temperature is one of the most challenging measurements for determining the junction-to-case thermal resistance (Theta jc) in high power packages. This is especially true for low Theta jc measurement, in which high power is necessary to control accuracy. Inaccurate case temperature measurement would lead to an inaccurate Theta jc value. This study explores different methods for...
This paper presents the design and the practical realization of a measurement stand dedicated to thermal characterization of electronic packages. The standard Dual Cold Plate (DCP) solution is enhanced with the Peltier Thermo-Electric Modules (TEMs) and a tensometer bridge. The TEMs are automatically controlled by a special circuit so as to provide either constant case temperature or constant thermal...
Contrary to popular belief the junction-to-case thermal resistance (Rth-JC) of a power semiconductor is not an intrinsic property of the device but depends to some extend on the cooling condition at the case surface intended for heat sinking. In addition to this the Rth-JC can be measured only with quite limited accuracy by the methods existing today. This paper investigates the dependence of the...
The standard procedure to measure the Rth-JC of semiconductor devices requires a thermocouple measurement of the case temperature while the IC-package is in contact with a water-cooled heat-sink. This method often produces wrong results since the measurement of the case temperature is quite prone to errors. Transient dual interface (TDI) measurements have been suggested as an alternative to overcome...
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