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The pitting and intergranular corrosion of cast aluminum alloy A356 were compared to that of aluminum alloy 6061 to test whether cast aluminum alloys can be used as a substitute for 6061 in select ocean engineering applications. Accelerated corrosion tests were conducted in a salt water and hydrogen peroxide environment at elevated temperature for over six hours. Metallographic samples were then examined...
Experimental and analytical results on the lifetime of 25 mu m diameter aluminum 1% silicon wire bonds subject to on/off current cycling are presented, along with related scanning electron microscopy of the heel area of the bond. The analytical results utilize a steady-state temperature solution for the wire in conjunction with finite element stress analysis to provide inputs to fracture mechanics...
Electromigration lifetests performed on a variety of Al alloy films to study the form of the failure distribution are discussed. Sample sizes ranged from 35 to 120, allowing exploration near the 1% failure level. Results show that the lognormal rather than the logarithmic extreme value distribution holds where the grain size is smaller than the linewidth. Where the grain exceeds the linewidth, however,...
Step spacing effects on electromigration in second-level runners of a two-level metal technology are investigated by stressing test structures with a wide range of spacing, of severe topography. Metal step coverage is affected by step spacing, and it is shown that regions with poor coverage (10, 20%) are particularly vulnerable to electromigration failure. When the interlevel dielectric processing...
Internal friction (IF) describes the mechanical energy losses in vibrating samples due to stress-induced movement of defects in solids. Such experiments on thin films provide direct experimental access to the examination of grain boundary diffusion phenomena, which are known to be the main origin of electromigration. It is found that for a series of Al-alloys there exists a correlation between the...
The electromigration of layered fine Al conductors (AlSi/TiN, AlSi/W, over/under) is discussed. The study indicates that (1) layering with refractory metals degrades the migration immunity of the Al layer, (2) refractory metal layers tend to suppress Al grain growth and crystal orientation, (3) by improving the film properties of refractory metals and optimizing the layer structure to minimize this...
A novel sputter-deposited Al-Si-Pd alloy has been investigated for use for VLSI interconnection in place of Al-Si-Cu-alloy. Workability of the Al-Si-Pd alloy in submicron patterning has proved to be much better than that of Al-Si-Cu alloy, and both electromigration resistance and stress-induced migration resistance are higher than those of Al-Si-Cu alloy. Long-term reliability tests of a resin-molded...
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