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Thickness of the TBC is a few hundred microns and is applied to protect against oxidation, hot corrosion and wear. Thin films coating of yttria stabilized zirconia (YSZ) have been coated on cast iron substrates. The morphology, structure properties were studied by scanning electron microscopy (SEM), X-ray diffraction (XRD).
Technology of argon plasma sputtering is presented, and a coil current (magnetic flux) variation effects on silicone based polymer surface has been tried to figure out. Silicone pieces were interacted with Ar plasma discharge under two different coil current values of 150A and 100A which produce fluxes of 87.5mTesla and 50mTesla at the centre of ECR discharge unit, respectively. The purpose of this...
This paper reported the study of growth of AlxGa1-xN thin film on a-plane sapphire substrate using plasma assisted metal organic chemical vapor deposition (PA-MOCVD). We have successfully growth the Al content AlGaN alloys and investigated the influence of TMA/TMAl+TMGa flow rate ratio to their crystal structure and surface morphology. From S EM image and XRD measurement, the AlGaN films grown with...
ZnO thin films were deposited on polyethersurfone (PES) substrates by atomic layer deposition (ALD). We investigated the effects of O2 plasma pretreatment from 0 W to 100 W before the ZnO growth. When the plasma power was increased, the PET substrate surface roughness was also increased. However, the surface roughness of ZnO on the roughest PET substrate with maximum plasma power pretreatment showed...
Novel dual-scaled superhydrophobic nano-flower surfaces were fabricated by 1-mask photolithography, DRIE and carbon nanotube (CNT) microwave plasma enhanced CVD (MPCVD). Patterned structure was characterized by SEM, TEM and AFM techniques. With the additional petal-like CNT structure, the apparent contact angle (ACA) increased dramatically compared with silicon (~140%) and parylene-coated (~78%) micropillar...
Summary form only given. Titanium nitride films are extensively used in numerous industrial areas owing to their superior mechanical properties such as high abrasion resistance, low friction coefficient, high temperature stability and high hardness. The mechanical properties of TiN film are strongly related to its preferred orientation. This work reports the deposition of poly crystalline and hard...
In this study, bottom-up electroplating is used for TSV (Through Silicon via) fabrication. With the metal temporarily bonding technology, we could remove the handling substrate and perform the chip stacking process. The TSVs made by bottom-up electroplating do not need the expensive MOCVD seed layer deposition and special designed electroplater/solution. Moreover, it is independent with the DRIE angle...
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