The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Driven by the thermal management demands of light emitting diodes (LEDs), the use of Computational Fluid Dynamics (CFD) by the lighting industry is growing. Establishing guidelines to ensure that these tools can be applied efficiently, i.e. sufficiently accurately without unnecessary complexity, would be very valuable to the industry. In this study a representative LED luminaire is assessed using...
Investigation deals with LED's thermal management optimization in dependence of operating condition aided by application of infrared thermography. Thermal management calculations allow estimating temperature distribution on the LEDs, metal - core printed circuit boards (MCPCB) and heat sink but often real results may be different and experimental investigations are necessary. Good results are obtained...
To improve heat dissipation of sapphire-based LEDs, we develop a new LED package with a dual heat spreader design. The first heat spreader is a cup-shaped copper sheet, which was directly contacted with sapphire to enhance heat dissipation of the chip itself. The second heat spreader is the die-bonding material of diamond-added AgSnCu solder and a high thermal conductive metal-core printed circuit...
The poor thermal design of high brightness light-emitting diodes (HB-LEDs) package for the automotive exterior lighting system causes the degradation of the optical and reliability performance, also the deterioration of the cost-effectiveness. We design the flexible package substrate with the thick heat-spreading layer and thermal via-hole fully filled with the copper (FFC) for the conventional process...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.