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To improve heat dissipation of sapphire-based LEDs, we develop a new LED package with a dual heat spreader design. The first heat spreader is a cup-shaped copper sheet, which was directly contacted with sapphire to enhance heat dissipation of the chip itself. The second heat spreader is the die-bonding material of diamond-added AgSnCu solder and a high thermal conductive metal-core printed circuit...
A simple, fast, and reliable characterization of thermal properties method to determine junction temperature (Tj) in high power GaN-based light emitting diodes (LED) was presented in this study. Thermal characteristics of high power light-emitting-diode have been analyzed by using a three-dimensional thermal conduction model. Maximum operation temperature has also been calculated. The induced thermal...
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