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Thermal resistance of high power blue Light Emitting Diode (LED) package is experimentally examined. The LED package consists of eight CREE EZ900 chips. The dimension of each chip is 880 µm×880 µm and the metal board area is 30 mm×32 mm with 3 mm thickness. The LED package is operated at the current of 11 A with 10 % duty cycle. To measure junction temperature, the forward voltage method is used....
Due to their long lifetime and high efficacy, solid state lighting (SSL) has the potential to revolutionize the illumination industry. The long lifetime claimed by the manufacturers is often based solely on the estimated depreciation of lumen for a single LED operating at 25°C. However, self heating and high environmental temperature which will lead to increased junction temperature and degradation...
Light emitting diode (LED) with a long lifetime, low power consumption, and low pollution has been successfully applied in many products. However, due to its low electro-optical conversion efficiency, high percentage of input power transformed to redundant heat, thus increasing the LED temperature. This phenomenon decreases the luminous flux, changing light color, and useful life span of LED. Therefore,...
The high-power Light Emitting Diode (LED) can be potentially used for general lighting to alleviate the global warming problem. However, the LED issues, associated with high cost, high junction temperature, low luminous efficiency, and low reliability, have to be resolved before becoming realized. Featuring low-junction-temperature and low-cost design, a novel high-power COP (Chip-on-Plate) LED package...
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