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Today, high-power LED packages have been widely used in many fields by virtue of its high efficiency, long service life and small size etc. A LED package consists of many different components, which are made of different materials being operated under different conditions. As a result, each component has its own pattern of impact on the reliability problem of LED packages, such as chip failure, package...
Thermal performance of phosphor-based white light emitting diodes (LEDs) under an input current of 350 mA is investigated by finite-element simulation in which the thermal and optical interactions are considered. It is demonstrated that the temperature of the phosphor particles, regardless of phosphor placement, is always higher than the junction temperature. It is concluded that the junction temperature,...
Reliability is one of the important problems in electronic packaging, which affects the use and life of the products. In this paper, we present a high power SiC-based light-emitting diode (LED), the thermal, mechanical and optical performances were investigated respectively. Heat dissipation performance and junction temperature were obtained using finite element analysis (FEA), the influences were...
The high-power Light Emitting Diode (LED) can be potentially used for general lighting to alleviate the global warming problem. However, the LED issues, associated with high cost, high junction temperature, low luminous efficiency, and low reliability, have to be resolved before becoming realized. Featuring low-junction-temperature and low-cost design, a novel high-power COP (Chip-on-Plate) LED package...
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