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A growing number of smart energy meters and electric charging stations have sparked a demand for a high precision, low value shunt resistors to measure the flow of electrical current. This paper investigates the possibility of trimming 100 micro ohms Manganin shunt resistors with tolerance of 5 percent to improve their accuracy and performance for use in smart energy meters. In theory, reducing the...
In this paper, 5Xnm cross point cell array for the low power ReRAM operation was developed with 1S1R cell structure. Through the optimization of both TiOx/TaOx based-1R and NbO2 based-1S stacks with TiN based-electrode, the world's first and best bipolar switching characteristics with the lowest operation current (20∼50uA) and sneak current (∼1uA) level were acquired.
There has recently been increased interest in carbon-based resistive random-access (RRAM) memory. Carbon-based RRAM has the potential to scale to atomic dimensions, resulting in ultra-high-density and low-power memory. Here we report reversible unipolar resistance switching in hydrogenated amorphous carbon. The devices used in this study are fabricated using e-beam lithography with built-in series...
There are some benefits for embedded passive devices, such as higher reliability by eliminating the solder joint failure from the surface discrete components, real-estate reduction by reducing the physical size of the printed circuit board assembly (PCBA) surface area, better frequency performance by avoiding the inherent parasitic effects from current surface mount technology (SMT). Definitely, embedded...
Electrically conductive adhesives (ECA) have potential for low cost, high reliability, and simple processing. Additionally, an important advantage with ECA materials is the possibility for low bonding temperature. Therefore, they are especially well suited for low cost applications. ECA materials are prepared by mixing polymer matrix with electrically conductive particles. In isotropic conductive...
This paper provides an overview of modeling of a group of commercially available solar cells to ease the study of solar powered electric systems. The models solar cells can be accurately used to predict the behavior of the system operation under different conditions.
Embedded passives devices are becoming increasingly important for next generation miniaturized systems. A Printed circuit boards (PCBs) is investigated in this paper with focus on passive devices. Film resistance, capacitance and inductance are embedded into the same board. The effects of embedded capacitors and inductance on signal integrity (SI) and electromagnetic compatibility (EMC) have been...
This paper reports a high performance bandgap voltage reference, in which the temperature is distinguished by a simple on chip thermometer. Four similar performance bandgap references operate in different temperature ranges with high preference. Each bandgap reference works with the discussion on the principle of the quadratic temperature compensation. Two resistors made of different materials are...
4F2 selector-less crossbar array 2Mb ReRAM test chip with 54nm technology has been successfully integrated for high cell efficiency and high density memory applications by implementing parts of decoders to row/column lines directly under the cell area. Read/write specifications for memory operation in a chip are presented by minimizing sneak current through unselected cells. The characteristics of...
This paper describes the students' awareness regarding the methods employed to mitigate the negative impact of computers on the environment. Several topics considered important by the students were analyzed — transforming computers into recyclable waste, increasing users' awareness toward extending computer lifetime, encouraging the reuse of old and obsolete computers, employing new ecological materials...
This paper reports the development process of a measurement system for mechanical stress detection. A piezoresistive silicon sensor chip is used to convert the inducted mechanical stress into a resistance change, measured by a developed resistance analyzer. Aim of our work was to simplify the sensor chip for high flexibility in design and adaption. The sensor chip can easily adapt to a device under...
This paper describes the development of piezoresistive MEMS force sensors constructed using paper as the structural material. The sensing principle of the paper-based sensor is based on the piezoresistive effect of conductive materials patterned on a paper substrate. The device is inexpensive (~$0.04/device for materials), simple to fabricate, lightweight, and disposable. The entire fabrication process...
From a fire development perspective, Class 2 transformers are generally regarded by the design engineering and standards (listing agencies) community to provide a safe method in which to power a wide variety of consumer and commercial electronic/electrical devices due their “intrinsic” current limiting features as stated in their specifications. However, Class 2 transformers can deliver current levels...
Pre-college students were randomly assigned to learn about electrical circuit analysis with an instructional program that included two problem solving practice conditions. In the first condition, students learned to solve parallel circuit problems that were contextualized around real electrical devices and represented with realistic diagrams. In the second condition, students learned to solve the...
Electrical contact materials deposited via thin-film processes enable the structuring of interfaces that optimize electrical contact performance. The performance gains are accomplished by structuring the contact material such that a conductive pathway is always present in the composite, a phenomenon related to the percolation threshold. The relationship between film composition and percolation threshold...
Screen-printing is not a new technology in the printed circuit industry. However, the combinations of new paste materials and an advanced screen-printing process further increases the value of printable flexible electronics that cannot be made by the traditional photolithography process with copper foils. Additionally, more functionality from the circuits will be generated with new materials in the...
To increase memory bandwidth with minimum area overhead, the new concept of 3D-stacked memory structure consisting of a small sense amplifier shared with a few 3D memory cells has been presented. The 16 bit 3D-stacked TiO2 memory chip was fabricated and demonstrated. The estimated bandwidth per unit area of 3D-stacked memory in sub-65 nm CMOS technology indicates that the 3D-stacked memory has potential...
There will be presented a concept for a tower-assembling-technology, which is particularly suitable for pressure sensors of the aeronautical and aerospace due to their high thermal and mechanical cycling stability. The developed vertical assembly is to be produced sequentially and offers the opportunity of a bus system. Through this bus system there can be maintained supply and signal lines. The assembling...
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