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IEEE Transactions on Very Large Scale Integration (VLSI) Systems > 2018 > 26 > 1 > 37 - 49
IEEE Design & Test > 2017 > 34 > 6 > 54 - 62
IEEE Transactions on Electron Devices > 2017 > 64 > 12 > 5284 - 5287
IEEE Transactions on Very Large Scale Integration (VLSI) Systems > 2017 > 25 > 12 > 3341 - 3354
IEEE Microwave and Wireless Components Letters > 2017 > 27 > 11 > 1007 - 1009
IEEE Transactions on Computer-Aided Design of Integrated Circuits and... > 2017 > 36 > 10 > 1688 - 1701
IEEE Microwave and Wireless Components Letters > 2017 > 27 > 10 > 921 - 923
IEEE Transactions on Very Large Scale Integration (VLSI) Systems > 2017 > 25 > 10 > 2893 - 2906
IEEE Electron Device Letters > 2017 > 38 > 9 > 1328 - 1330
IEEE Transactions on Semiconductor Manufacturing > 2017 > 30 > 3 > 216 - 226
IEEE Transactions on Circuits and Systems I: Regular Papers > 2017 > 64 > 8 > 2073 - 2085
IEEE Transactions on Electron Devices > 2017 > 64 > 7 > 2842 - 2848
IEEE Transactions on Circuits and Systems I: Regular Papers > 2017 > 64 > 5 > 1173 - 1186
IEEE Transactions on Very Large Scale Integration (VLSI) Systems > 2017 > 25 > 4 > 1573 - 1577
IEEE Transactions on Microwave Theory and Techniques > 2017 > 65 > 4 > 1372 - 1380
IEEE Transactions on Very Large Scale Integration (VLSI) Systems > 2017 > 25 > 4 > 1297 - 1306
IEEE Design & Test > 2017 > 34 > 2 > 24 - 30
IEEE Design & Test > 2017 > 34 > 2 > 69 - 78
IEEE Journal of Solid-State Circuits > 2017 > 52 > 4 > 940 - 949