The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
There is a growing requirement for distributed sensors to measure, monitor and control systems such as airframes, wind turbines, engines, power trains, human motion and seismic sensors. These type of devices need to be as unobtrusive as possible and miniaturisation of the sensor and its control circuitry is a key factor in achieving this. This paper reports on a method of combining the sensor element...
Silicon thinned to 50 mum and less is flexible allowing the fabrication of flexible and conformable electronics. Two techniques have been developed to achieve this goal using thinned die: die flip chip bonded onto flexible substrates [polyimide and liquid crystal polymer (LCP)] and die flip chip laminated onto LCP films. A key to achieving each of these techniques is the thinning of die to a thickness...
The use of flip chip bonding technology on AuSn microbumps for flip chip packaging is becoming increasingly important in the electronics industry. Some of the main advantages of AuSn system over solder flip chip technology are suitability for very fine pitch interconnection, low assembly cost and fluxless bonding. Fluxless flip chip assembly is in demand especially for medical applications and optoelectonics...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.