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This paper reports a novel, low-cost and inherently simple vertical signal transmission method for glass-silicon-glass sandwich micro-electro-mechanical systems (MEMS) gyroscopes based on heavily doped silicon-bridge. As for the fabrication technique, only glass-to-silicon anodic bonding and after-laser-trimming process are needed, which are fully compatible with standard MEMS technology. Micro gyroscopes...
Thin-body GeOI substrates with thin Al2O3/SiO2 BOX layers are successfully fabricated for the first time. It is found that the bonding interface was robust enough for Mechanical Polishing and CMP even after bonding at a room temperature in atmosphere. The GeOI surfaces etched with ozone water are atomically flat. Moreover, Dit of as low as 3.9e+11 eV-1cm-2 at the GeOI/BOX is obtained. These results...
Effective decoupling is crucial for the optimum performance of the power distribution network in an electronic system. As component packaging technologies evolve enabling tighter integration and faster operation of electronic systems, it is important to develop better decoupling strategies. This paper describes several new or proposed packaging structures and evaluates the connection inductance associated...
Twisted direct silicon bonded (DSB) substrate demonstrates a higher hole mobility advantage over (110) bulk substrate for PFET. The mobility shows a (110) layer thickness dependence with the thinner DSB layer having a higher hole mobility. 25% on-current improvement is obtained for thin DSB PFETs at long channel (Lg= 2 mum), 10% higher at short channel (Lg = 36 nm) compared to (110) bulk PFETs. Moreover,...
Design and characterization of a new generation of single-photon avalanche diodes (SPAD) array, manufactured by ST-Microelectronics in Catania, Italy, are presented. Device performances, investigated in several experimental conditions and here reported, demonstrate their suitability in many applications. SPADs are thin p-n junctions operating above the breakdown condition in Geiger mode at low voltage...
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