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The paper presents the result of studies and investigations related to planar thermoelectric generators, intended to be realized through printing technologies. The recent development in printing technologies and materials makes possible the realization of thermoelectric pairs in planar configuration as an alternative to the already used devices. The use of printing technologies permits the realization...
In engineering applications, the material strength and stiffness have a great influence on the accuracy of one antenna box structure, and temperature is another influence factor. In this paper, taking one antenna box structure for example, considering the temperature compensation of the structure, a micro-displacement measurement system was built to realize the micro-displacement measurement of the...
In this paper, the shape identification method in the Inverse Heat Conduction Problems (IHCP) is applied to estimate the shape of frost on a refrigeration tube. The inverse algorithm consists of direct, inverse analysis and gradient-based optimization method. The direct analysis used Finite Element Method (FEM) in an unstructured grid system to solve the direct heat conduction problem. The inverse...
In order to determine the accelerated test conditions, and clarify the internal thermal stress distribution of the accelerometers, ANSYS analyzed the effect of loading different temperature rates and wind speed on the internal temperature rate of accelerometers. And the ANSYS simulation result shows that, if the wind speed is constant and dose not exceed a certain value, the internal temperature rate...
In this paper, we present a novel electrical test structure for determining the thermal expansion coefficients (TECs) of micromachined polysilicon thin films. The electrothermal properties of the test structure are analyzed. The pull-in method is exploited in characterizing TECs of thin films. In addition, an analytical model and a measurement method are developed. The finite element software ANSYS...
In the past decade, the general public's means of transportation has begun to undergo a radical transformation, moving away from only using gasoline and moving toward using a combination of gasoline and electricity. One parameter that shouldn't stand in the way is the overall reliability of the electric vehicle, which is dependent upon the electric connections between the power source and the motor...
Aiming at complexity of hydrogeological conditions of coal mine, this paper brought forward the improved chaos-genetic optimization method based on the chaos optimization method and genetic algorithm method. Using the optimization method, this paper have carried out the back analysis of earth temperature field of coal mine, then predicted the earth temperature field using the parameters of the back...
The purpose of this study is to in-situ measure the warpage of the PCB with surface-mount dual in-line memory module (DIMM) sockets during reflow process by using strain gages. In the experiments, a full-field shadow moire is used for measuring real-time out-of-plane deformations (or warpage) of the PCB with DIMM sockets under heating condition. A finite element method (FEM) is used to analyze the...
When the flip-chip packaging has been moving to the lead-free, fine-pitch and high-current-density packaging, the flip chip with copper-pillar-bump interconnects can provide a solution to this need. However, this package during the thermal cycling test (TCT) still suffers the reliability problems such as delamination at the Cu low-k materials or at the interface between the UBM (under bump metallurgy)...
Due to stringent environmental regulations, a solar power plant that produces energy without pollution has gained more attention in recent years. The high-concentration photovoltaic (HCPV) module is one of the popular solar energy systems due to its small deployed area and high conversion efficiency. However, it may also be subjected to higher temperature in the operating environment. The degradation...
In recent years, electronic product have been demanded more functionalities, miniaturization, higher performance, reliability and low cost. Therefore, IC chip is required to deliver more signal I/O and better electrical characteristics under the same package footprint. None-Lead Bump Array (NBA) Chip Scale Structure is then developed to meet those requirements offering better electrical performance,...
In this paper a 3-D methodology for the heating hazard assessment on transformer covers based on electromagnetic analytical formulation linked with thermal finite element method is presented. The proposed methodology allows computing the temperature on metallic device elements heated by electromagnetic induction. The methodology is specially recommended for those cases where depth of electromagnetic...
Microelectronic packages can be considered as composite structures fabricated from highly dissimilar materials. Interface delamination related failure often occurs when the packaged devices are subjected to thermo-mechanical loading. The analysis of delamination of a laminate structure with a crack along the interface is central to the characterization of interfacial toughness. Due to the mismatch...
Deformation Measurements under thermo-mechanical load are quick and useful tool to increase the reliability of electronic products and to verify Finite Element Models (FEM). Two Examples demonstrate the advanced use.
Proportional-integral-derivative (PID) controllers have been widely used in temperature control system. It is difficult to obtain good control performances if the fixed PID parameters are used. The adaptive control schemes are complexity in practice and difficult to obtain suitable results for strong nonlinearity systems. The learning cost of neural networks and genetic algorithms are considerably...
In this study, a dynamic elastic-plastic finite element model is used to simulate the bone temperature rise during drilling process. Various rotating speeds and applied forces of the drill bit are investigated to explore the effects of these parameters on the temperature rise within the bone. The results indicate that a drill bit with a higher rotating speed or a higher applied force can have noticeable...
Based on the standard of International Electrotechnical Commission (IEC) on the thermal cycling test for a high concentration photovoltaic (HCPV) module, frequent current input must be applied when oven temperature exceeds 25°C. As such, the junction temperature of a solar cell chip would oscillate due to the joule heating effect. However, the fluctuation of the junction temperature might be one of...
A MEMS (Micro Electro-mechanical System) resonator-type viscosity sensor with range from 0 to 1 mPa·s was presented with good frequency response and high sensitivity. Its sensitive chip with a triangular cantilever structure was investigated. This paper studied the operating principle of the MEMS resonator-type viscosity sensor. The natural frequency of the sensitive chip was deduced with its structure...
The studying team prepared stress-absorbing material interlayer (SAMI) modified asphalt mixture by the best use of local conditions to test its actual modulus of elasticity, Combining with actual local conditions, Studying team ultimately determine the SAMI practical elastic modulus, which was applied to ANSYS finite element method (FEM) software to calculate the different stress effect of the SAMI...
Titanium alloys are widely used in aerospace industry due to their excellent mechanical properties. Because of their low thermal conductivity, high chemical activity, large friction coefficient and so on, such problems occur during the cutting process as high cutting temperature, large specific cutting force and serious tool wear, leading to low machining efficiency. The titanium alloys classified...
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