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The area of mobile applications is observing a big shift in its foundation. Traditionally, mobile applications emphasized low power consumption at the cost of low performance. However, the recent spread of “smart” mobile devices (e.g., smartphone) asks for very high computing performance of underlying chips. This paper describes key technical factors - including silicon processing...
While the potential of FinFETs for large-scale integration (LSI) was demonstrated before on relaxed device dimensions, in this paper we present performance data of aggressively scaled transistors, ring oscillators and SRAM cells. FinFET SRAMs are shown to have excellent VDD scalability (SNM=185 mV at 0.6 V), enabling sub-32 nm low-voltage design.
We present a generic method for analyzing the effect of process variability in nanoscale circuits. The proposed framework uses kernel and a generic tail probability estimator to eliminate the need for a-priori density choice for the nature of circuit variation. This allows capturing the true nature of the circuit variation from a few random samples of its observed responses. The data-driven, non-parametric,...
Novel 3D stacked gate-all-around multichannel CMOS architectures were developed to propose low leakage solutions and new design opportunities for sub-32 nm nodes. Those architectures offer specific advantages compared to other planar or non planar CMOS devices. In particular, ultra-low IOFF (< 20 pA/mum) and high ION (> 2.2 mA/mum) were demonstrated. Moreover, those transistors do not suffer...
3D contactless technology based on capacitive coupling represents a promising solution for high-speed and low power signaling in vertically integrated chips. AC coupled interconnects do not suffer from mechanical stress, and the parasitic load is much reduced when compared to standard DC solutions, such as wire bonding and micro bumps. Communication system based on wireless interconnection scheme...
This paper describes a methodology for building a reliable internet core router that considers the vulnerability of its electronic components to single event upset (SEU). It begins with a set of meaningful system level metrics that can be related to product reliability requirements. A specification is then defined that can be effectively used during the system architecture, silicon and software design...
3D integration offers a technology that meets the requirements of the current trend in high performance microprocessors. It offers the opportunity to continue the performance trends the industry enjoyed in the past. To take advantage of this opportunity system architecture and design needs to utilize the new possibilities that 3D integration provides.
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