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A major hurdle in VLSI/ULSI technology has been the inability to grow ultrathin oxides with low defect and interface trap densities and to generate a planar stress-free silicon/silicon-dioxide (Si/SiO/sub 2/) interface. The authors describe the fabrication of thin multilayered stacked SiO/sub 2/ structure with such qualities. A huge improvement in the quality of these stacked oxides has been achieved...
Reliable Al metallization has been performed using a plasma CVD (chemical vapor deposition) technique. In-situ doping of carbon onto an Al film suppresses the growth of Al crystal grains, hillocks and spikes. MTFs (median times to failure) of the films due to electromigration are one order of magnitude greater than that of a pure Al film. The resistivity is reduced by a factor of 3 to 4 when carbon-doped...
A shallow trench isolation (STI) technology, RIE (reactive ion etching), CVD (chemical vapor deposition) oxide fill, and polarization are used to realize lithography-limited, submicron device and isolation dimensions. A novel boron diffusion technique is used for nMOSFET field doping, so that the parasitic sidewall inversion (leakage) problem is eliminated. It is shown that both the channel width...
A novel local interconnect technology utilizing polysilicon strapped with selective CVD (chemical vapor deposition) tungsten (W) has been developed for advanced CMOS applications. Problems associated with etching of a local interconnect material do not exist, since the local interconnects are of polysilicon and defined at the same level as the gate electrodes. CVD W deposited on the polysilicon serves...
The authors report a novel method of fabricating chemical-vapor-deposited (CVD) small-grain tungsten films and its application to multilevel metal interconnects. By interrupting the tungsten grain growth using a layer of thin silicon and by consuming the silicon layer during subsequent tungsten deposition, tungsten films with fine grains can be obtained. The fine-grained tungsten shows a significant...
Selective growth of aluminum with smooth surface topography is realized using a double-wall CVD (chemical vapor deposition) system in which the substrate is positioned between two heaters with different temperatures. Aluminium is deposited selectively onto silicon, metals, and silicides of the substrate; no deposition occurs on the SiO/sub 2/ surface. This technique is available for filling high-aspect...
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