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In this paper, a novel anisotropic conductive film (ACF) flip chip bonding method using ultrasonic vibration for flip chip interconnection is demonstrated. The curing and bonding behaviors of ACFs by ultrasonic vibration were investigated using a 40-kHz ultrasonic bonder with longitudinal vibration. In situ temperature of the ACF layer during ultrasonic (U/S) bonding was measured to investigate the...
In this study, the curing and bonding behaviors of ACFs by ultrasonic vibration for flip chip interconnection were investigated using a 40 kHz ultrasonic bonder with longitudinal vibration. In-situ temperature of the ACF layer during thermosonic (TS) bonding was measured to investigate the effects of substrate materials and substrate temperature. Curing of the ACFs by ultrasonic vibration was investigated...
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