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In the design of high-speed digital circuit, the transmission of digital signal by the differential pair can solve signal integrity issues effectively. Making use of an actual PCB, its signal integrity and “eye diagram” performances were simulated by the HyperLynx software. The high-frequency performance of the PCB was improved, and the potential signal integrity problems were settled. It is proved...
This paper presents a study on various signal integrity (SI) issues that could affect signals on Printed Circuit Boards (PCBs). This paper is aimed to analyze and have a better understanding on the nature of signal integrity, how the problem is manifested in PCB designs and what design solutions can be employed to minimize its effects. The PCB designs are modelled using the Advanced Design System...
In this paper, a complete simulation methodology is introduced to analyze the signal integrity in a double data rate (DDR3) high-speed memory module. The equivalent models of the first-level package and various discontinuities in printed circuit board (PCB) are extracted, and then linked together by using general transmission-line models for the interconnections. Good agreements between the simulated...
The high performance window-BGA for a high speed Synchronous Dynamic Random Access Memory (SDRAM) has been designed. In this paper, power distribution system (PDS) design on IC package is discussed and studied. A appropriate PDS design will provide not only the stable power supply but also the superior current return path for signal channels. The simulation approach will cover complete Signal Integrity...
In this paper, an on-chip eye opening monitor circuit has been proposed with 4 ps time and 4 mv voltage resolutions for analyzing signal integrity of on-chip high speed channel. The proposed eye opening monitor circuit can detect the maximum 6.4 Gbps data rate and give eye diagrams depending on on-chip high speed channel conditions. The performance of the proposed eye opening monitor circuit was verified...
Wire bond ball grid array technology is widely used in the Intelreg South Bridge, or I/O controller hub (ICH) for a few generations. With the continuing scaling speed of the I/O interfaces, ICH has SATA Gen 2 links and PCI express links operating at 2.5 Gbits/s and 3 Gbits/s respectively within one chip. Due to the heavy traffic and new features, it pushes the electrical performance of wire bond ball...
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