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Chip-On-Film (COF) packaging is an attractive solution for the direct attachment of chips onto a polyimide (PI) substrate patterned with copper leads. However, despite its many advantages, the eutectic Au-Sn alloy formed in the high temperature bonding process has a number of unsolved reliability issues. Accordingly, the current study performs a series of experiments to investigate the heat dissipation...
PoP is a potential solution to high-speed memory packaging. For PoP package, warpage is known as a concern over package stacking and SMT yield. The PoP package under current study has these features such as fine pitch which is 0.5 mm for both top and bottom, small ball size and that most solder balls are located at the packagepsilas two longer edges. Therefore the solder joint reliability (SJR) in...
This paper discusses electromagnetic (EM) and thermal co-analysis for chip, package and board co-design and co-simulation. The limitation of classical divide-and-conquer approaches based on cascading techniques are investigated in reference to global methodologies where chip, package and board are simulated using one single model methodology. Cascade and single model methodologies are applied to a...
We demonstrate a micromachined flexible chip-to-board chip interconnect structure for a chip scale package. Micromachined flexible interconnects enable robust operation in high thermal cycling environments, even for high pinout chips due to the flexible interconnect ability to absorb thermal expansion strain. The interconnects on the chip-side and printed wiring board (PWB)-side are united by electroplating...
This paper addresses reconfigurations and the cooling of a 3D stacked mesh array by considering thermo-radiation. We propose a heuristic replacement policy to avoid defects on a wafer by moving hot processing elements (PEs) toward edge of the wafer to cool efficiently. Introducing a thermo-radiation model for the 3D stacked complex, the reconfiguration performance and thermo-radiation of the 3D stacked...
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