The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Thermal management is a key issue in LED packaging. To keep the LED junction temperature as low as possible, one has to address the spreading effect from a localised heat source into a bigger substrate as it is the case in the Chip On Board configuration (COB). We performed a benchmark of the existing analytical models for the spreading effect and derived a new model that allows a better prediction...
Market drivers, technology scaling and integration trends of application processor packaging are first presented. Component level and board level quality and reliability challenges are then discussed in the areas of thin die and thin core package warpage, lead free flip chip die to package interconnect mechanical integrity, and lead free package to motherboard solder joint reliability. Challenges...
Flipchip Technology is getting more and more important for future packaging solutions. This presentation gives an overview of different Flipchip Technology Solutions provided by industry. Mainstream Technologies such as C4 and ACF / ACP processes are explained. In special focus will be recently developed new processes to improve: Thermosonic Gold to Gold Interconnect (GGI) Process and Encapsulant...
We derive in this paper equations of motion of board-level IC packages subjected to swept sine vibration loads following the support excitation scheme. Harmonic analysis is performed based on the argument such that at each loading state over the swept sine process, hysteresis responses of solder joints following the isotropic hardening rule vanish fairly quickly so that plasticity is fully developed...
The effects of underfills on the thermal cycling test of lead-free (SnAgCu) PBGA packages on ImAg (immersion silver) PCB are investigated. Three different underfills are studied. These underfills are dispensed on the PCB to fill the gaps between the BT (bismaleimide triazene) substrate of the PBGA, the Sn3wt%Ag0.5wt%Cu (SAC) solder balls, and the PCB. In addition, two more sets of samples (without...
The ball impact test is developed as a package-level measure for the board-level drop reliability of solder joints in the sense that it leads to fracturing of solder joints around the intermetallics, similar to that from a board-level drop test. In this paper, both board-level drop test and package-level ball impact test are examined numerically for solder joints of nine Sn-Ag-Cu solder compositions...
A solder joint life prediction process utilizing finite element modeling is described. The main target is the board-on-chip (BOC) package for the DDR-II DRAM. 3D finite element model is developed in a parametric and automatic manner to effectively investigate various design/material perspectives. The model is verified with real package deformation measured by a moire interferometric technique. Several...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.