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Reliability has been a critical issue for thermal interface materials, especially when the materials are used for high power applications. In this paper, a series of reliability tests including baking, humidity chamber, temperature cycling, power cycling, and thermal shock have been conducted. Through comparison with conventional thermal pastes or phase change materials, a novel thermal paste with...
The long term thermal stability of the die attach is a crucial issue for high brightness light emitting diodes (HB LEDs), which affects the junction-to-case thermal resistance, luminous flux and life time seriously. In this paper, an improved power and temperature cycling method is proposed to evaluate the thermal stability of the die attach materials for HB LEDs. The structure function method is...
In this paper, a novel mechanism is shown to cause the failure evolution in a metallization system under fast temperature cycle stress. The failure evolution is triggered by the lateral temperature distribution across the device, which causes an accumulating plastic deformation of the metallization. The root cause for the deformation emerges at the position of the maximum gradient in temperature.
Aluminum wire bonds, as used in a ceramic air cavity package for LDMOS, will intrinsically be prone to mechanical fatigue due to temperature and power cycling causing the wires to expand and shrink in a cyclical way. Under certain pulsed application conditions, the required amount of current cycles the product must survive is so high that not just low cycle fatigue, caused by cyclic plastic deformation,...
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