The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Nanosilver paste has become a promising lead-free die-attach material for power electronic packaging. This development solves the challenges faced by power device manufacturers to replace the lead-based or lead-free solders for high-temperature applications. This paper proposes the reliability of a 1200-V/150-A multichip insulated-gate bipolar transistor (IGBT) module using pressureless sintering...
HVIGBT (High Voltage Insulated Gate Bipolar Transistor) modules are installed in traction drive applications and large industrial motor drive applications, so they require high power density and reliability. Enhancing power density of power modules increases thermal stress and especially reduces power cycle lifetime. This paper describes the design approach for reducing thermal stress by reducing...
This paper focuses on the performance of IPM (Intelligent Power Module) under power cycling test which is simulated by a FEA (Finite Element Analysis) method. Through the method of control variables some key parameters about the module's thermal and structure properties can be obtained. The key parameters in the calculation include power dissipation of silicon chip, cycle period, different materials...
This paper focuses on the performance of IPM (Intelligent Power Module) under power cycling test which is simulated by a FEA (Finite Element Analysis) method. Through the method of control variables some key parameters about the module's thermal and structure properties can be obtained. The key parameters in the calculation include power dissipation of silicon chip, cycle period, different materials...
Automotive industries require new technologies to fulfil the electrical and hybrid vehicle applications. The current substrate materials for power module are not suitable for these applications because of the performance (mismatch in CTE for copper lead frame for instance) and the cost (high manufacturing cost and poor machinability for DBC AlN substrate for instance). The aim of the investigation...
The life time of the solder joint between base plate and ceramic substrate is usually tested by passively heating and cooling the power module (thermal cycling). This provokes delamination in the solder layer. But, the silicon dies in the power module are actively heated in the application. The accelerated life time test simulating this load is power cycling. The modules commonly fail at the end of...
In order to meet the through-life reliability targets for power modules, it is critical to understand the response of typical wear-out mechanisms, for example wire-bond lifting and solder degradation, to in-service environmental and load-induced thermal cycling. Application of accurate wear-out models can identify the dominant failure mechanisms at the design stage and can be employed in reliability...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.