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The paper is concerned with the development of a micro testing machine for solder joint specimens. The micro tester has been developed for testing a new solder alloy, namely Innolot (Sn-Ag3.7Cu0.65Bi3.0Sb1.43Ni0.15), under various cross-beam speeds and temperatures. In addition, the procedure for fabricating lap-shear solder joints, which will be tested under monotonic and creep loadings, is given...
Electroless nickel-high-phosphorus Ni–P plating is used as substrate coating in the electronic component technology. The ability to minimize pores formation in solder joints and the wettability of the Ni–P layer remain points of investigation. The qualities and the control of the physical and chemical properties of the deposits are essential for the reliability of the products. In this contribution...
Automotive industries require new technologies to fulfil the electrical and hybrid vehicle applications. The current substrate materials for power module are not suitable for these applications because of the performance (mismatch in CTE for copper lead frame for instance) and the cost (high manufacturing cost and poor machinability for DBC AlN substrate for instance). The aim of the investigation...
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