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PoP is a potential solution to high-speed memory packaging. For PoP package, warpage is known as a concern over package stacking and SMT yield. The PoP package under current study has these features such as fine pitch which is 0.5 mm for both top and bottom, small ball size and that most solder balls are located at the packagepsilas two longer edges. Therefore the solder joint reliability (SJR) in...
The two main forces pushing package technologies to a new frontier are size and cost. The need of the hour is miniaturization, fuelled by rapidly growing complexity in the wireless phone market. CSP(chip scale packaging) has already reached 100% and further miniaturization can be achieved only by 3D packaging techniques. Complex 3D packaging techniques having hit the roadmap, the SoC design is largely...
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