The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The welded joints are often dimensioned over one given lifetime while following an approach of the type S-N on the basis of acceptable probability of failure which should not be exceeded over the base period. The cracks induced by the welding process can be propagated and become critical during the useful lifetime of the structure, unless they are detected and repaired in time. Consequently, prevention...
This report shows that the reliability of amorphous InGaZnO (a-IGZO) thin-film transistors (TFT) are improved when a-IGZO is deposited using an inductively coupled plasma (ICP) sputtering system. Here the ICP sputtering system that we developed proved effective for improving the reliability of a-IGZO TFTs. The results of negative gate bias stress test (NBS) showed threshold voltage shift (ΔVth) decreased...
Hot carrier reliability imposes challenges in the design of STI-based laterally diffused metal-oxide-semiconductor (LDMOS) devices as the device feature is miniaturized. Efforts to quantify the degradation are crucial in countering the device reliability risk. This paper investigates the effect of shallow trench isolation (STI) angle on hot carrier effect (HCI) of STI-based LDMOS devices. The effect...
Mechanical impact or shock resulted from inevitably transport or usage of electronic equipment, may cause great stress and strain in the electronic package, even lead to the failure of electronic equipment, so it's of great significance to explore the mechanical behavior of electronic packaging under drop/impact. In all kinds of package, 3D System in Package with Through Silicon Via has become a hot...
Merging units used in intelligent substation presented a considerable high field failure rate. To reveal the potential defects, highly accelerated life test was studied to solve the problem. The possible reasons for the poor reliability were discussed. Based on the main field failure mechanisms of the merging units, combined with the application environment and work profile, a modified highly accelerated...
In this study three-dimensional finite analysis models of 3D micro-scale chip scale package (CSP) solder joints were set up. The stress-strain distribution of micro-scale CSP solder joints was obtained by finite element analysis under the condition of random vibration load. The influence of different solder, pad diameter and solder joint volume on the stress-strain of micro-scale CSP solder joint...
Surface mount technology solder joint reliability issue is the impact on the performance of surface mount components and the service life of the key problems, the main factors which influence the reliability of including the internal quality of welds, mechanical properties and loading conditions of solder joints. This paper mainly focused on the pins' failure of Ceramic Small Out-Line Package (CSOP)...
This work investigates the effects of encapsulation on deformation behavior and fatigue lifetime of horseshoe-patterned stretchable interconnects, under uniaxial cyclic tensile loading. The finite element software ABAQUS is applied to analyze the deformational behavior of stretchable interconnects under different cyclic stretching conditions (10%, 15% and 20% elongation). Then according to the finite...
Thermal wind sensor has been used to measure wind speed and direction in high temperature due to its principle. In this paper, a novel structure is proposed. It consists of a silicon sensing substrate and a ceramic chip for packaging, in which the sensing chip with through silicon vias (TSV) is Cu-Sn eutectic bonded to the ceramic. This paper focuses on the thermal-mechanical reliability of the novel...
Three-dimensional structure has been achieved using interlayer connecting technology with double-side solder bump and the lifetime of the solder joints under thermal shock test has been forecasted by finite element method. The simulation result presents that the stress at the interface between 0.76mm solder bump and PCB is evidently higher than that in other places. The interface between 0.76mm solder...
In this work, the component type and failure rate prediction model of LED control gear are introduced. According to the failure mode of key components in practical application, the reliability test and failure rate prediction method are combined to study the effect of temperature factor on the failure rate of components in the control gear.
To study the thermal cycling reliability through the SMT technology, this paper based on the EAM experiment to test the correction of the ANSYS analysis. We have a deeper comprehend on the affluence of the creep property, to give a conclusion whether the SMT technology is reasonable. The results show: QFN solder is the main factor; In the thermal recycle analysis, the location in the edge of solder...
Lower energy consumption, higher conversion efficiency, and longer life lead to a widely use of light emitting diode (LED) in illumination applications. However, the long product life makes it difficult to do reliability test due to the long time it cost. Generally, the reliability performance of the LED is evaluated by thermal cycling and thermal shock. In this paper, a new reliability testing method...
Electronic components continue to high reliability, high performance, multi-functional, miniaturization direction. High-density integrated ball grid array (BGA) surface assembly technology is widely used in the field of microelectronics packaging. In this paper, the crack failure behavior of plastic ball grid array (PBGA) is studied under mechanical vibration load. The stress - strain distribution...
Conventional reliability demonstration test based on statistical method is widely used in industry as it is simple and convenient to apply. But for the products with high reliability and long life, this test method fails to satisfy the demand for short cycle and low cost, and is liable to cause the phenomenon of over-test and short-test. This paper gives a step-stress accelerated sequential probability...
Distribution System Operators (DSO's) in the Netherlands are generally more focused on Medium Voltage (MV) grids than on Low Voltage (LV) grids as higher voltage levels contribute more to the SAIDI. However increasing interruption times, increasing costs and the energy transition on LV level encourage the DSO's to focus on LV grids as well. A first step is the investigation of failures in LV grid...
This paper analyzes the situation and harmfulness of over-temperature using avionic device and combine with the international standard IEC/TR 62240, gives four methods of avionics device uprating. They are separately device parameter re-characterisation, stress balancing, parameter conformance assessment and higher assembly level testing, all of these provide the theory basis for over-temperature...
Based on the field failure mechanisms in smart electrical energy meters, field operating abnormal data and maintenance data were analyzed. Discrimination analysis for field data was screened for predicting residual life. Through thoroughgoing analysis, field failure data, failure modes, failure mechanisms and external inducing stresses as well as their features with time were analyzed. Then the degradation...
The reliability of electronics products has become a serious problem due to the increasingly harsh environmental conditions when the products are in use. Due to demand on greater performance and higher integration in microelectronic devices, the electronics industry has been seeking suitable components, packaging and cooling techniques to achieve low-cost and high-reliability. This paper presents...
With the requirements of higher board level reliability, researchers gradually turned attention to complex composition solders like Sn-Ag-Cu-Ni-Bi solders. This quinary system solder has lower melting point and higher tensile strength than traditional Sn-Ag-Cu solder, which may good for the reliability. In this research, the effects of tensile strength on thermal fatigue properties of Sn-2Ag-0.5Cu-0...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.