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The CuIn1-xGaxSe2 (CIGS) films are prepared by the selenization process including the deposition of the metal precursors followed by heating the metal precursors in a Se overpressure. The impacts of Se deposition rates on the morphology, grain growth, and atomic ratios of the resulting CIGS films are investigated. The CIGS films prepared at the high Se flow rate exhibit the improved surface morphology...
Arc mobility on contact surface is an important factor in contact erosion and circuit interruption. The two stages of arc mobility are the initial immobile arc followed by the running arc. Past work in the literature showed that immobile arc time is dependent of contact material, current and contact separation speed until a minimum separation speed is reached. When the arc is in the running stage,...
Dust may cause corrosion in humid environment. Investigation of water solution of dust collected from Beijing and Shanghai showed that SO4-2 and Cl-1 were the major negative ions and Na+1, K+1, Ca+2 dominated the positive ions. Obvious corrosion was formed on the coupon surface when such solution was dropped on. Artificial particles including NaCl, Na2SO4 and CaSO4 are selected to simulate dust corrosion...
Contact materials based on copper-chromium are widely used in vacuum interrupters for medium-voltage applications. The microstructures of contacts are rather coarse, with typical chromium particle sizes in the range of 100 microns. During switching operations, such as short-circuit current interruption, a vacuum arc is generated which in turn produces melted and resolidified layers at the contact...
In this work, IMC (Inter metallic compound) of lead free (Sn-Ag-Cu (SAC)) and lead (62Sn-36Pb-2Ag (SP)) solder joint on the four kinds of surface finished of ball grid array (BGA) pad, such as Immersion Tin (ImSn), Organic solderability preservatives (OSPs), Ni-P/Pd/Au (ENEPIG), and Ni-P/Au (ENIG) were investigated by Focus Ion Beam microscope (FIB). Sample after failure ageing conditions (Baking...
In this study, the microstructural characteristics and mechanical properties of the electro-deposited Cu foils with different preferred orientations were investigated. Three types of foils were studied, including HTE (high temperature elongation), MP (middle profile) and VLP (very low profile). Observation results indicate that the columnar grains of the HTE - MP and VLP-A samples with (220) preferred...
Self assembled monolayer (SAM) of alkane-thiol of 6-carbon (1-hexanethiol, C6) chain length is applied on Cu surface (deposited on Si substrate) and examined carefully. Firstly, the ability of SAM adsorption onto Cu surface is confirmed by the sharp rise of water contact angle (CA) on the surface. Next, the thermal stability of SAM when it is stored in different environments is studied. The CA decreases...
In this study, the multi-layer structure effect on the Sn whisker growth in the matte Sn/Fe-42 wt% Ni (Alloy 42) systems was investigated. The Alloy 42 substrates were electroplated with 1.8 μm-thick of the Cu layer (CuE), electrolessplated with 0.3 μm μm-thick Cu layer (CuC), and electroplated with 1.8 μm-thick Ni layer, respectively. Thus, 4 kinds of multilayer specimens, CuE/Sn/Alloy 42, CuC/Sn/Alloy...
Recently, System in Package (SiP) technology is used to integrate a number of integrated circuits (ICs) enclosed in a single package or a module, which attracts a great attention from electronic industries due to its characteristics of smaller size, higher performance, lower overall cost and reduction of time to market. Based on the configurations of current SiP, there are two types of structure:...
A Cu/Ni UBM and Sn-2.5Ag lead-free solder for 20 μm pitch micro-bump was successfully fabricated via consecutive electroplatings of Cu, Ni, and binary SnAg. Materials characterizations such as Scanning Electron Microscopy (SEM), X-ray Diffraction (XRD), Electron Probe Micro-analyzer (EPMA), and X-ay Photoelectron Spectroscopy (XPS) were carried out to obtain relevant materials properties. We observed...
A new lead-free solder alloy Sn3Ag0.5Cu3Bi0.05Cr (SACBC) was prepared by adding 3.0 wt.% Bi and 0.05 wt.% Cr on the basis of the composition of Sn3Ag0.5Cu(SAC). The tensile strength and the growth behavior of the interfacial intermetallic compound (IMC) of SAC/Cu substrate and the SACBC/Cu solder joints during isothermal aging at 150°C for 0, 24, 168, 500 and 1000 hours were comparatively investigated,...
Electrodeposited Co-P thin film has recently attracted a lot attention due to its good high-frequency performance, large magnetic susceptibility, relatively high resistivity and growth rate. Co-P soft magnetic films can be synthesized by either direct current or pulse current plating. The effects of the pulse current on the properties of the electrodeposited Co-P film have not been fully investigated...
Copper wire bonding is the most effective alternative of gold wire bonding. As copper is more chemical reactive than gold, easier oxidation is one of the most major problem copper wire bonding encountered. Anti-oxidation technology must be used in copper wire bonding process. In general, there are two different ways to improve the anti-oxidation properties of copper bonding wire. One of which is injecting...
Due to have excellent thermal, electrical performance, W-Cu composite materials were wildly used in high-power microwave devices and large-scale integrated circuits as the substrate, embedded blocks, connectors and heat dissipation devices. This paper aiming at the problem of welding failure between a batch of home-made W-Cu composite materials and the Kovar alloy when doing microwave circuit welding...
A flexible polymer is considered as an alternative of low-cost mold materials. Molds with a high density aspect ratio, smooth surface, vertical sidewalls and lightweight have been fabricated and it is easy-to-use features in the hot embossing process. The fabricated flexible metal/polymer molds are expected to have the same quality as silicon or Ni-mold has. This also indicated that the flexible metal/polymer...
TiN diffusion barrier layers were deposited on SiO2/Si substrate by ALD method that employed TiCl4 and NH3 as the source and reactant gases, respectively, at a temperature range between 350°C and 500°C. Properties of films, including deposition rate, resistivity, surface roughness and chemical composition, were investigated, and performance of TiN diffusion barrier layer was also verified. Deposition...
Aluminum has been widely used in integrated circuit (IC) chip interconnect As the IC feature sizes continue to shrink, the RC delay of the interconnect wire has become the main delay of the system, instead of the intrinsic gate delay. For the higher speed responsibility, the resistance of the interconnects should be reduced. Copper interconnect has become the only one option for the semiconductor...
Copper electrodeposited on nickel and copper alloys substrates is easy to be oxidized, and the adhesion between the oxides and substrates can be so poor that delamination happens at these interfaces, which may lead to an overall failure to the electronic device. In this work, three different substrates were prepared by applying direct current; of all these substrates the amorphous nickel-phosphorous...
Selective catalytic reduction (SCR) of nitrogen oxide (NO) technology has widely applied in a combustion process to decline the concentration of NO due to its impact on the environments concerns. In this study, mesoporous SBA-15 was used as support material to load Cu catalyst to undergo the DeNOx reaction by CO. Cu/SBA-15 catalyst were prepared by polyol method and investigated by XRD, TEM and FTIR...
We have used a lift-off technique and X-ray photoelectron spectroscopy to probe initially buried interfaces of a CdTe solar cell after CdCl2 and contact treatments. We find that the cleavage takes place at or near the CdTe/CdS interface. On both surfaces, Cl is present, most likely due to diffusion through the CdTe layer during the high-temperature CdCl2 activation step. Te is present on both cleavage-exposed...
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