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The goal of this research is to evaluate the effects of La addition on the microstructure and microhardness of Sn-Ag based solders. Sn-3.5Ag-xLa ternary alloy solder were prepared by adding 0-1.0 wt% La into a Sn-3.5Ag alloy. Copper substrates were then dipped into these solders and aged at 150degC for up to 625 hours. The microstructure and microhardness of the as solidified solder and the aged solder/copper...
SnPb solder joints are an essential part for microelectronic packages manufacturing industrial for a long time. In recent year, environmental concerns and RoHS (Restriction of Use of Hazardous Substances) has demanded elimination of lead from electronics products by July 1, 2006. However, base on increasing pressures to achieve environmentally friendly electronic materials and processes, and indeed,...
The solders used for this study are Sn2.5Ag0.8Cu doped with 0.03 wt.% Fe, Co, or Ni and 0, 0.005, 0.01, 0.06, or 0.1 wt.% Ni. Reaction conditions included multiple reflows for up to 10 times and solid-state aging at 160degC for up to 2000 hrs. In multiple reflow study, Cu6Sn5 was the only reaction product observed for all the different solders used. Reflows using the solder without doping produced...
Gradually diminishing solderability and potential risk of whisker growth are two major concerns in using immersion tin as a final finish for printed wiring boards. Both phenomena are attributable to the spontaneous formation of intermetallic compounds (IMC) of Cu6Sn5 and Cu3Sn between the tin coating and copper substrate. The formation of IMC consumes the free tin in the coating that is essential...
To meet the urgent demands of future electronic packages, the solder joints have to become increasingly miniaturized. Compared to the large solder joints, mechanics behavior for the samll solder joints is very different, resulting in a series of reliability issues. Therefore, it is very important to understand the mechanics behavior of the small solder joints. In this paper, the shear test of the...
In this paper, the interfacial reactions of Sn-8Zn-3Bi and Sn-8Zn-3Bi-0.3Cr solders with Cu pads and the growth of IMCs during long-term aging treatment were presented and discussed. Less than 3 mum Cu5Zn8 IMC layer was found at the Sn-8Zn-3Bi-(0.3)Cr/Cu during the reflow at 230degC for 1 min. During solid state aging treatment at 150degC for 4, 9, 16, 25 days, the Cu5Zn8 IMC grown up with the extension...
The effects of the fourth Ni element on microstructure and monotonic shear strength of Sn-3.0Ag-0.5Cu lead-free solder were investigated. The addition of the Ni element makes the new (CuxNi1-x)6Sn5 phase, which improves the solder microstructure. The results indicate that the addition of Ni element increases the shear strength of solder joint. When the content of Ni is 0.10 wt.%, the shear strength...
The goal of the study is to compare quality of lead-free vapour phase reflowed solder joints soldered on different printed circuit board (PCB) surface finishes. The solder joints quality comparison is based on evaluation of microstructure development of the solder, solder/PCB pad interface and on the measurement of the solder joints nonlinearity of the current-voltage (C-V) characteristics. The microstructure...
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