The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Ultrafast x-ray absorption spectroscopy and diffraction techniques are used to directly record the superionic structural phase transition in nanoscale copper sulfide.
Some problems, such as high energy consumption, short life and high frequency maintenance, exist in reverberatory furnace which is the key equipment for production of reclaimed copper. Measurement data for energy balance indicate the major reasons are incomplete combustion and too high temperature at some location. In this paper, the coupling numerical simulation on fluid flow, heat transfer and combustion...
Carbon nanotubes have been widely studied due to its excellent electrical, thermal and mechanical properties, showing promising applications in both active and passive components in electronic devices. However, for such devices to be developed, compatibility issues for obtaining quality carbon nanotubes with suitable underlying substrates have to be understood. In this work, a technique to study the...
With the increasing speed of information and communication equipment in recent years, together with the high-speed signal processing of LSIs, there is a requirement for build-up electrical insulation materials (used in IC package substrates) to have low-dielectric loss tangent which reduces dielectric loss so as to achieve low transmission loss in the high-frequency GHz bands. At the same time, there...
Industry is moving towards having module with multiple functions and capabilities in order to satisfy consumer demands. Miniaturized the package will allowed more components to pack inside the electronic gadget. A low z-foot print of the package is one of the approaches to miniaturize the package. The adoption of micro-bump solders in the chip allowed low standoff Chip to Wafer (C2W) solder interconnects...
The application of copper-TSVs for 3D-IC-integration generates novel challenges for reliability analysis and prediction, i.e. to master multiple failure criteria for combined loading including residual stresses, interface delamination, cracking and fatigue. So, the thermal expansion mismatch between copper and silicon yields to stress situation in silicon surrounding the TSVs which is influencing...
In consideration of bare Fiber Bragg Grating being fragility, an approach of polymer and copper capillary package for FBG is proposed in this paper. FBG is coated with acrylate. After second coating, FBG is packaged into a blank copper capillary. FBG can expand or contract freely without strain. The second coating protects bare FBG from damage. The comparison of the experimental results between coated...
In lead free solder alloys — SnAgCu or SnZn alloys — the knowledge of the composition and the mechanical behavior of their IMCs is important to understand the reliability of small solder joint built up by one or two grains. Metallographic investigations, hardness testing and EBSD measurements (Electron Backscatter Diffraction) will be combined to characterize the mechanical and physical parameters...
The interfacial interaction between liquid eutectic Sn9Zn solder and electroplated Ni layer was investigated in the temperatures range of 230 ∼ 290°C. The interaction gives rise to various Ni-Zn intermetallic compounds, Ni5Zn21 and NiZn3, and Ni-Zn solid solution layer. The evolution of these layers is temperature dependent. The thickness of the interfacial reaction layer was measured with respect...
The aim of the study was to investigate the Surface Insulation Resistance (SIR) change of different surfaces finishes during Thermal Humidity Bias test (THB). The studied surface finishes was bare Copper (bCu), Organic Solderability Preservative (OSP), immersion Tin (iSn) and Sn63Pb Hot Air Solder Leveling (HASL). The test panels were comb patterns with and without solder mask, and on some of the...
The aim of this work is to define a joule heating prediction tool under DC stress for thick copper/Low-k inductors on glass substrate technology. The thermal resistance experimental results have been approximated by an empirical model and, combined with thermal coefficient of resistance formalism; allow us to define an analytical temperature joule heating formula. This analytical joule heating formula...
In a thermoelectric generator (TEG), hundreds of individual couples of two thermoelectrically dissimilar materials are electrically connected in series, but thermally in parallel within a given heat flux. Thus, the devices generate a few 10s of mW and may, for example, be used in wireless sensor applications. Apart from highly integrated costly batch fabricated micro TEGs for niche applications, commercially...
Internal gear pumps have significant advantages over other types of pump, such like high operating pressure, efficient transmission of energy, long service life, little pressure ripples and low noise emissions. Due to the nature of water, such as, low viscosity, poor lubricity and high vapour pressure, the performance of water hydraulic internal gear pumps is totally different from the oil ones. Using...
Basic understanding of heating conduction in lead-free solder joints due to the Joule heating effect was carried out by using the infrared (IR) microscopy. In order to interpret the corresponding mechanism and provide a better understanding to Electromigration (EM) studies, a newly developed ID solder joint with same cross-sectional area in solder alloy and Cu electrodes was employed in our thermal...
In the last half a century, the complexity of electronic systems has undergone a sustainable rapid development stage following the Moore's law: the density of integrated circuits (ICs) was doubled every two years. As a result, electronic devices become more miniaturized in space and contain more power in unit volume. Electronic package has to deal with highly increased I/Os with fine soldering pitch...
This work reports on an experimental investigation of the potential of using selected commercially available organic conductive polymers as active ingredients in thermocouples printed on textiles. Poly(3, 4-ethylenedioxythiophene): poly(4 styrenesulfonate) (PEDOT:PSS) and polyaniline (PANI) were screen printed onto woven cotton textile. The influence of multiple thermocycles between 235 K (−38°C)...
Large power low speed Permanent Magnet Synchronous motors are more and more widely used in propulsion areas. Their tests are relatively more inconvenient because some special and large power equipments are needed. In this paper, according to the features of multiphase and multiunit for these kinds of motors, a novel and simplified testing method of copper loss and its temperature raise is brought...
Several studies have shown that Cu-poor Cu(In, Ga)Se2 shows potential fluctuations at low temperatures which dramatically reduce the mobility and thus the diffusion length in solar cells. It is however often assumed that the fluctuations persist at room temperature. In order to characterize the properties of these fluctuations and their temperature dependence epitaxial CuInSe2 and CuGaSe2 absorbers...
We report here the study of synthesis and characterization of length-tunable vertically-aligned CuO nanowires grown by thermal oxidation of electrodeposited Cu films. From TEM and electron diffraction analyses, all the CuO nanowires produced were single crystalline with a monoclinic structure. For samples oxidized at different temperatures, the lengths of CuO nanowires were found to increase parabolically...
A modified electrospinning setup with parallel electrode and heater plate was presented to fabricate piezoelectric nanofibrous membrane directly. Thanks to the strong electric field strength, high stretch ratio and high environmental temperature during the electrospinning process, α-phase poly (vinylidene fluoride) (PVDF) would be transformed to β-phase well and have excellent piezoelectric performance...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.