The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Structural and electrical properties as well as peculiarities of degradation processes in the Cu- and Ni-enriched thick-film elements based on oxymanganospinel ceramics are investigated. The thermal “shock” effect in the initial stage of isothermal exposure at 170 oC with future stabilization of electrical resistance on this level up to final degradation test was revealed. It is shown that high temperature-sensitivity...
Spatio-temporal atlas is a useful tool in imaging studies of neurodevelopment, which characterizes the growth of brain, and allows the monitoring of its development. The imaging of preterm and term born infants provides opportunities to develop a series of spatio-temporal atlases that track the changes during the particular period of neurodevelopment between. The aim of this paper is to develop a...
The microstructure of lead-free solder joints often consists of only one or a few randomly oriented tin grains as a result of a large degree of undercooling during solidification. Due to the severe anisotropy of single crystal Sn and the random nature of the microstructure, the stress state and microstructural evolution of each joint will be unique.
In this work an investigation of compressive strength and forgeability behavior have been made to explore the effect of SiC nano particles on A356 alloy matrix for the development of A356/SiC nanocomposites using two step mixing through stir casting technique. A356 alloy ingot was selected as a matrix and AFP+SiCn (99.9% pure aluminium fine powder+nano size SiC mechanically forged by using ball mill...
Laser metal deposition (LMD) is one of the additive manufacturing technologies that is used in the production of fully dense parts layer by layer. This innovative manufacturing process has the potential to reduce the weight, time and cost of manufacturing components. It is able to process different metallic powders and also produce custom alloy or functionally graded material by consolidating different...
Dissimilar metal joining methods are essential for the manufacturing of a various structures and parts in the industries. Friction stir spot welding process was performed on 3 mm thick AA1060 and C11000. This paper presents the results on the microstructure, chemical analysis and electrical resistivities of the produced joints. The microstructure showed a contrast between the two different materials...
This paper presents a new method for making three-dimensional structure on the surface of an elastomer substrate. In general, micromachining based on lithography process is layer-by-layer fabrication, and the resulting structure is restricted to be two-dimensional. In this paper, we presented that three-dimensional structures were achieved by attaching a thin film partially onto an elastomer. Under...
We report a new method patterning cells and hydrogels on two different scales to form a biomimetic in vitro liver tissue by electromicrofluidic (EMF) techniques. Compared to our previous work [1-2], here we show (1) a variety of hydrogels with varied stiffness and corresponding encapsulated cell types, (2) the arrangement of multiple cell types to recapitulate hepatic lobules, and (3) manipulations...
This paper reports a novel DNA manipulation technique for the analysis of single DNA molecules under a fluorescence microscope. We successfully manipulated single DNA molecules using two microstructures driven by two laser beams, where we handled them like “chopsticks”. We evaluated the dimensions and the shapes of microstructures, intended for grasping single DNA molecules efficiently. We have found...
We have developed an aqueous-solvent-based micro-molding technique for creating polymeric, bio-degradable micro-structures which can be loaded with delicate bio-active therapeutic agents. The process enables the incorporation of emerging protein-or DNA-based vaccines into sophisticated micro structures, e.g., microneedles, without damaging their biological efficacy as conventional (UV-or temperature-based)...
The paper reports the improvement of tensile strength of single-crystal silicon (SCS) microstructures fully coated with sub-micrometer thick diamond like carbon (DLC) film using plasma enhanced chemical vapor deposition (PECVD). To minimize the deformations or damages caused by non-uniform coating of DLC, which has high residual stress, the released SCS specimens with the dimensions of 120 μm long,...
We report on wafer-scale high resolution patterning of bio-microstructures using silk fibroin light chain (L-fibroin) as the photoresist material. The L-fibroin fragments with the well-defined molecular weight have been successfully isolated from the integral silk fibroins consisting both heavy and light chains. Under facile biochemical modification, the L-fibroin photoresist can be synthesized via...
This paper reports on a biomimetic microskeleton actuated by muscle fibers (figure 1(a)). The 3D microskeleton is based on concatenated rib elements fabricated by two-photon polymerization of a custom-made hydrogel (figure 1(b)). For the first time, micrometer-sized skeletons were fabricated, overgrown with functional muscle fibers, and contracted at significant amplitudes. Compared to planar biomimetic...
In this paper, we report a large-area, microporous polydimethylsiloxane (M-PDMS) membrane with maximum enhancement of fracture strain by 210% over the bulk PDMS (B-PDMS) film. The three-dimensional microporous structures, which contributes to the stretchability enhancement by underlying physical analysis, are fabricated by removing monodisperse polystyrene (PS) sphere arrays in PDMS matrix. Integrated...
Conventional welding techniques like arc welding, tungsten inert gas welding (TIG), metal inert gas welding (MIG) etc.; causes health problems like bronchitis, airway irritation, lung function changes, lung fibrosis, asthma and a possible increase in the incidence of lung cancer due to the emission of exhaust gases coming from the traditional arc welding. In this context an environment friendly technique...
Algorithms for mining very large graphs, such as those representing online social networks, to discover the relative frequency of small subgraphs within them are of high interest to sociologists, computer scientists and marketeers alike. However, the computation of these network motif statistics via naive enumeration is infeasible for either its prohibitive computational costs or access restrictions...
The aim of this study is to simulate thermal properties of Bensmim clay-wool composite through using microstructure based finite element modeling. These materials have been chosen due to their low cost and local availability. Cutting edge software tools that implement finite element methods will be used in order to first generate the 3D microstructure of the composites and then simulate the thermal...
Many important properties of materials such as strength, ductility, hardness and conductivity are determined by the microstructures of the material. During the formation of these microstructures, grain coarsening plays an important role. The Cahn-Hilliard equation has been applied extensively to simulate the coarsening kinetics of a two-phase microstructure. It is well accepted that the limited capabilities...
For understanding full IMCs solder joints comprehensively, the widely used Cu-Sn system was adopted as the research object. A study on optimization of process parameters, microstructure evolution and fracture behavior for full Cu3Sn solder joints in electronic packaging was conducted systematically. For forming full Cu3Sn solder joints, 260°C, 1N, 5h was determined as the optimal parameter combination...
Nowadays, the microelectronics industry broadly uses the flipchip technology to enhance the packaging density. However, the small size and the unique geometry of the flip-chip solder joints induce the electromigration (EM) reliability issue. In this study, a Pb-free solder joints (SAC1205) was EM tested by a current of 7.5×103 A/cm2. During the tests, a three-dimensional (3D) X-ray laminography method...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.