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This study presents a multi-disciplinary approach in order to investigate the influence of hygroscopic stresses and stress relaxation in Epoxy Molding Compounds (EMC) on the apparent interfacial fracture toughness of Cu/EMC interfaces. Bi-material beams were designed and produced via transfer molding similarly to the process used in state-of-the-art semiconductor packaging. An empirical method was...
This work will present case studies of three types of flexible printable circuits subjected to different loading conditions in order to evaluate their technologies regarding mechanical reliability. Typical causes of failure in electronic devices are associated with mechanical stress, moisture, heat from transportation and field use. Typically manufacturers carry out tests to evaluate the reliability...
In this paper we show a self-consistent methodology to characterize the stress-induced mobility variation in silicon-based devices. The synergy among different experimental techniques (the application of an external mechanical stress and the measure of the process-induced stress), theoretical calculations (based on the finite elements method and the band structure calculation), and silicon validation...
A thorough understanding of the mechanics of lead-free solder joint in a ball grid array (BGA) assembly under expected operating conditions is essential in developing reliable life prediction models. In this respect, accurate deformation response of Sn-4Ag-0.5Cu (SAC405) solder under varying temperature cycles and straining rates is established using unified inelastic strain theory. The mechanics...
Since mechanical stress sometimes degrades both electronic functions and reliability of LSI chips, it is very important to control the residual stress in them to assure their highly reliable performance. The authors have already found that the distribution of the residual stress on a transistor formation surface of a chip changes significantly by changing the bump joint structure of packages or modules...
The pull-in problem of fixed-fixed beam structures cannot be solved analytically due to its nonlinear from the large deflection and the electrostatic driving force. So to understanding the characters of the devices, the designers have to resort to numerical techniques. Lack of an accurate model for predicting pull-in voltage for basic micromachined beam structures necessitates the clear need for a...
In this paper an experimental validation of numerical approaches aimed to predict the coupled behaviour of microbeams for out-of-plane bending tests is performed. This work completes a previous investigation concerning in plane microbeams bending.
Pre-bending effects of Nb3Sn composite wires, enhancement in Jc at the as-cooled condition and Jc peak, Jcm, against applied tensile strain, are well known in especially Cu-Nb reinforced Cu stabilized Nb3Sn wire. In an attempt to understand the effects, three directional strain analyses using FEM were studied by considering thermally-induced residual strain due to temperature difference between the...
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