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The magnitude of the I/O requirements for modern ICs continues to increase due to the growing complexity and size of ICs. The large I/O count found on most ICs have forced most designers to use flip-chip packaging instead of wire bonded packaging. Unfortunately, the solder bumps in flip-chip packages are susceptible to failure, especially in the presence of high temperatures which can cause large...
Requirements for system availability for ultrahigh reliability electronic systems such as airborne and space electronic systems are driving the need for advanced health monitoring techniques for the early detection of the onset of damage. Aerospace electronic systems usually face a very harsh environment, requiring them to survive the high strain rates, e.g., during launch and reentry, and thermal...
A global/local method along with an optimization algorithm, so called the modified sub-modeling approach of the optimal equivalent solder is introduced as a simple but effective approach to predict the deformation and the reliability in the package. The viewpoint of equivalent solder in this method is facilitated to obviously reduce the number of elements/nodes so as to enhance computing accuracy...
In this paper, thick film chip resistors with two different types of solder alloys namely SnPb and SnAgCu have been evaluated for the effects of the solder alloy elemental composition on the solder joint failures under cyclic temperature loading conditions. The creep properties of both solders have been modelled using the Garofalo equation and the creep strain energy density has been extracted and...
Interfacial delamination is one of the primary concerns in electronic package design. Pop-corning in plastic-encapsulated IC packages is a defect frequently occurring during the solder reflow due to moisture penetration into the packages. Moisture absorption has a detrimental effect on the EMC/Cu interfacial adhesion and drastically reduces the reliability of the encapsulated package. To obtain good...
An electro-thermo coupling finite element model for lead free Sn4.0Ag0.5Cu (SAC405) solder ball is developed to investigate the electromigration and electro-thermo-mechanical effects on electronic packaging in the present paper. SAC405 alloy solder ball are commonly used on BGA package and POP package. In this research, a single solder ball (bump) used on flip chip package is established to evaluate...
This paper presents the high reliability design method for lead-free solder joints on chip components, and that is able to evaluate effect of soldering process for solder joint shape. Coupled analysis of structure analysis and flow analysis was proposed for replication of solder wetting and behavior of electric components at the same time. The analysis methods enable to evaluate complex mechanism...
With the increasing use of Pb free solder in Electronic assemblies the estimation of their reliability under field use conditions is becoming important. The acceleration factor for solder depends on delta T, dwell times, ramp rates, actual values of temperature extremes, and the type of package. During the last few years, a number of papers have been published to determine the acceleration factors...
This paper presents a method mining the worst thermal fatigue life of solder joints on chip components used in vehicle electronics. Thermal fatigue life of crack initiation and propagation were calculated by using the finite element method. Statistical analysis of thermal fatigue life in the solder layer below the chip component was carried out. A sample of dispersed fatigue lives was generated by...
Information processing has been thought of as a key to ubiquitous systems. Operating systems composing ubiquitous systems are also important since ubiquitous systems do not provide desired performance when the operating systems fail. Bluetooth module becomes a critical item for these operating systems. Thus, accurate reliability estimation of the module under various environmental conditions is required...
Embedded passives represent a promising solution regarding the reduction of size and assembly costs of system in package (SiP). In addition, the benefits also include improvements in electrical performance and reliability. Although embedded passives are more reliable by elimination solder joint interconnects, they also introduce other concerns such as deformation and component instability. More layers...
PbSnAg solder was widely used in die attachment for high power chip packaging, and the thermal-mechanical reliability of PbSnAg solder layer is a key factor to evaluate the quality of high power devices packaging. Viscoplastic finite-element simulation methodologies were utilized to predict Pb92.5Sn5Ag2.5 solder joint reliability for die attachment under accelerated temperature cycling conditions...
Goldmann Constants and Norris-Landzberg acceleration factors for lead-free solders have been developed based on principal component regression models (PCR) for reliability prediction and part selection of area-array packaging architectures under thermo-mechanical loads. Models have been developed in conjunction with Stepwise Regression Methods for identification of the main effects. Package architectures...
This paper described a ceramic ball grid array (CBGA) and its second level reliability. The CBGA uses a substrate with high coefficient of thermal expansion (CTE) and leadfree soldering. The reworkability of the BGA package and board was also studied. The results have shown that this package is reworkable without a significant reliability reduction in the board level reliability. The reliability of...
It is well known, reliability and workability are the more important issues in the field of chip size package (CSP). Creep and fatigue behaviors are the main loads of the solder joints, the reliability of which should take account of those two main loads. Based on the theory of continuum damage mechanics (CDM), this paper focuses on damage evolution of interaction between the fatigue and creep. A...
A novel method of mechanical reliability analysis on vibration fatigue failure of muBGA solder joints, based on the heating factor Qeta, is introduced. Firstly, a two-parameter weibull distribution is used to model the collected data of vibration fatigue lifetime for different Qeta. After that, two explicit functions are deduced in a unified mathematic expression form, which give an intuitionistic...
Four process parameters including, the pad length, the pad width, the stencil thickness and the stand-off, are chosen as four control factors, and by using an L25(56) orthogonal array, the no-fillet chip component solder joints shapes with 25 different process parameters combinations are established. And then all the shape prediction models of the 25 solder joints are built through the Surface Evolver...
The existing automatic optical inspection (AOI) equipment can be used to check out the defect of the electronic products, such as solder bridging, tomb stone and so on. Based on the existing AOI, a new intelligent optical inspection analysis (IOIA) technology is brought forward in this paper. The method, which combines off-line analysis and on-line contrast, is employed in the IOIA technology. That...
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