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In addition to a reduced Ag content, it has been demonstrated that significant improvement of drop test performance of Sn-Ag-Cu solder joints can be achieved by alloying with Mn and Ti. This study aims to investigate the effects of Mn and Ti additives on the microstructure and solidification behavior of Sn-1.0Ag-0.5Cu alloys, as well as mechanical properties and thus to explain how the alloying elements...
In this paper, a new methodology to extract the elasto-plastic properties of lead-free solder materials from an instrumented sharp indentation loading curve has been proposed using dimensional analysis and finite element computation. The nano indenter XP technology is used to test samples of lead-free eutectic SnAgCu solder alloys to obtain a load-displacement curve, which can be used to calculate...
In this work, the Ag content effect on material properties of Sn-xAg-0.5Cu solders was investigated based on tensile test for bulk solder. In this study, three different Ag contents including 1%, 2% and 3% Ag in Sn-xAg-0.5Cu solder were investigated. The material properties, such as elastic modulus, UTS (ultimate tensile strength) and yield stress were evaluated for different Ag content bulk solder...
A series of tensile tests of 95.5Sn4.0Ag0.5Cu under a wide range of temperatures and constant strain rates are conducted. Base on the test results, empirical equations for predicting tensile strength, elastic modulus and yield stress are fitted as the functions of temperature. From the data of tests, it is found that temperature and strain rate demonstrate crucial effects on tensile and creep properties...
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