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In this paper, a fabrication method for a hybrid structure of the poly-N-Isopropylacrylamide (pNIPAAm) gel as a soft material and the SU-8 as a solid material is proposed. This pNIPAAm-SU8 hybrid structure can be applied to various applications such as gel actuators. These hybrid structures have a serious problem that it is easily broken by the difference of swelling rate. Our proposed hybrid structure...
A modified electrospinning setup with parallel electrode and heater plate was presented to fabricate piezoelectric nanofibrous membrane directly. Thanks to the strong electric field strength, high stretch ratio and high environmental temperature during the electrospinning process, α-phase poly (vinylidene fluoride) (PVDF) would be transformed to β-phase well and have excellent piezoelectric performance...
Wafer-level hybrid copper/polymer bonding technology suitable for wafer-level 3D integration (called “thinning after bonding”) was developed. A damascene process is applied for fabricating copper pads. After chemical mechanical polishing (CMP), a globally flat bonding surface is obtained by co-planarization of copper and polymer during barrier CMP. The key to this co-planarization process is optimizing...
The paper describes the first use of a thermoelectric material to create a thermally driven, bi-directional pump with no moving parts using the thermal transpiration effect (called a Knudsen pump). The use of a thermoelectric material to create the temperature gradient increases the efficiency of the pump and enables the design of a bi-directional pump. Pumps using thermal transpiration reported in...
Interfacial delamination is known as one of the root causes of failure in microelectronic industry. In order to explore the risk of interface damage, FE simulations for the fabrication steps as well as for the testing conditions are generally made in the design stage. In order to be able to judge the risk for interface fracture, the critical fracture properties of the interfaces being applied should...
An ongoing root cause of failure in microelectronic industry is interface delamination. In order to explore the risk of interface damage, FE simulations for the fabrication steps as well as for the testing conditions are generally made in the design stage. In order to be able to judge the risk for interface fracture, the critical fracture properties of the interfaces being applied should be available,...
In this paper we present the results of a study done to compare and contrast BCB and ALX polymers in typical WLP structures fabricated at RTI. Based on initial studies of the materials vendor, Asahi Glass Corp, AGC, we have examined the processing parameter space of ALX-211, in order to develop scalable manufacturing processes for these films. We present process flow and photo property data on ALX-211,...
Interfacial adhesion between the Epoxy Molding Compound (EMC) and the copper-based leadframe is one of the major concerns in the qualification of plastic packages. Since the conventional shear testing methods used in industry do not consider the residual stresses in the shear samples, they are only used as a qualitative testing method for the EMC qualifications. However, since these tests are based...
This paper investigates the fast chargeability of lithium polymer batteries. Attempts to fast charge 100 A-h lithium polymer batteries are presented in this paper. The tests were done at five charging currents: 50 amperes (0.5C), 100 amperes (1C), 200 amperes (2C), 300 amperes (3C), and 320 amperes (3.2C). The tests were done at three ambient temperatures: -20, 0.0, and +20degC. The currents, voltages,...
The SrTiO3 and Y-doped SrTiO3 polycrystalline sintered bodies were synthesized by the polymerized complex (PC) process and the subsequent hot pressing at 1473 K for 1 h or at 1673 K for 2 h in Ar atmosphere. The X-ray diffraction patterns of the SrTiO3 and Sr0.9Y0.1TiO3 samples synthesized by the PC process and hot pressing at 1473 K showed that these samples were mostly composed of the SrTiO3 single...
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