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Since mechanical stress sometimes degrades both electronic functions and reliability of LSI chips, it is very important to control the residual stress in them to assure their highly reliable performance. The authors have already found that the distribution of the residual stress on a transistor formation surface of a chip changes significantly by changing the bump joint structure of packages or modules...
One approach to 3D chip stacking and integration is to process filled Cu-vias into the Si and to attach them to a next level die by means of thermocompression bonding. This results in induced stresses in the silicon due to the large CTE disparity between copper and silicon, and also from the force applied during thermocompression bonding. These stresses can have an impact on the performance of the...
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