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Printed circuit boards (PCB) are found in almost all electronic devices. During manufacturing and field operation, these PCBs are subjected to different loads, which cause stresses and deformations. Excessive stresses and deformations of PCB can lead to system failure. Thermo mechanical simulation helps to predict stress distribution in manufacturing and operational condition. PCB object consists...
A flow is presented to evaluate analog CMOS circuit performance pending temporal MOSFET degradation. The change in threshold voltage due to the bias temperature instability (BTI) mechanism is used as a paradigm. The tasks of performance evaluation and MOSFET degradation are decoupled in the flow. This is extended to severalize the model of degradation at three time scales: that of signal processing,...
For several decades, the output from semiconductor manufacturers has been high volume products with process optimisation being continued throughout the lifetime of the product to ensure a satisfactory yield. However, product lifetimes are continually shrinking to keep pace with market demands. Furthermore there is an increase in dasiafoundrypsila business where product volumes are low; consequently...
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