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High temperatures and non-uniform temperature distributions have become a serious concern since they limit both performance and reliability of Integrated Circuits (IC). With computer architect's concern to position microarchitecture blocks in a processor, faster thermal models can be developed at the cost of hiding finer grain details such as circuit or transistor level information. Several methods...
Self heating in electrostatically actuated RF MEM capacitive shunt switches is analyzed by coupled electrical and thermal simulations using three-dimensional finite-element analysis. The result shows that despite highly nonuniform current and temperature distributions, the self-heating effect can be approximated by lumped thermal resistances of the switch membrane and the substrate. Additionally,...
Generators for wave energy converters are enclosed within sealed containers. The thermal exchange mechanism is based both on natural convection occurring in the air within the container and in the water outside it. Conduction occurs in all other domains. To assess the maximum allowable electrical loading a numerical approach based on thermal simulation and Computational Fluid Dynamics (CFD) is developed...
GaAs based hetero-junction bipolar transistors (HBTs) offer high speed and good device matching characteristics that are attractive for many high-speed circuits. However, thermal behaviors with multi-fingers can significantly affect HBTs performance. In this paper, three dimensional (3-D) finite-element modeling (FEM) approaches are built up to analyze the maximum temperature region and temperature...
Failure analysis in complex integrated microelectronic devices is of increasing importance to improve their reliability, quality, and manufacturing yield. Non-destructive testing methods for localisation of shorts and opens in the internal circuitry are required, particularly for complex and fully packaged devices. The method of lock-in thermography (LIT) was developed for localisation of electrically...
In this paper the multidomain simulations of silicon sensors are presented. Authors on the basis of electro-thermal converter show the idea of operation basic structure made by silicon. All structures were simulated in ANSYS and SUGAR software. They allow checking the behavior of such sensors as electro-thermal converter, silicon micromirror, comb-drive resonator, etc. Simulation results are valuable...
This communication reports on the design of ultra-low power micro-hotplates on polyimide (PI) substrate based on thermal simulations and characterization. The goal of this study was, by establishing a simulation model for very small scale heating elements, to decrease the power consumption of PI micro-hotplates to few mWs to make them suitable for very low-power applications. To this end, the mean...
The reality of high temperature non-uniformity has become a serious concern in the CMOS VLSI industry limiting both the performance and the reliability of packaged chips. Thus the surface temperature profile of VLSI ICs has become critical information in chip design flow. for fast computation of surface temperature profile, power blurring (PB) method has been developed. This method can be applied...
In order to enhance the properties of automotive parts, thermal transfer and deformation analyses were performed for the hat-shaped specimen under heat treatment process using FEM (Finite Element Method) program, LS-DYNA. Temperature distribution and deformed shape for the elapsed time were obtained from the simulation. Numerical results were in good agreement with the experimental results from high...
Up to now, it is difficult to test the inner temperatures of sealed electromagnetic relays. In this paper, the temperature distribution of a sealed electromagnetic relay is obtained by using 3-D finite element analysis. The quality of thermal simulation results depends on the accuracy of both the modeled heat sources and heat sinks. Due to the high performance requirements of sealed electromagnetic...
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