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As one of the promising lead-free interconnection materials, electrically conductive adhesive (ECA) has made considerable advances in recent years. Compared to metal solder, ECAs offer numerous advantages, such as environmental friendliness (elimination of lead usage and flux cleaning), mild processing conditions, fewer processing steps (reducing processing cost), low stress on the substrates and...
With the development trend of microelectronic system with small size, high speed, high frequency and high density, passive and active components are directly embedded into a core or high-density-interconnect layers. This System-in-Package (SiP) technology could shorten interconnection between the die and substrate and reduce the inductance and noise interference. However, there are many electrical...
The work presented here shows the impact of different macro pattern density on the interconnect profile and CD bias after metal etch processing. These effects are shown to be due to macro loading and passivation affects which differ when wafer level pattern density is changed. The effect of passivation gas on the above phenomenon is also investigated.
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