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Low melting alloy is mixed with Cu filler as thermal interface materials. The thermal performance is investigated by inserting the composite between Al blocks. The ratio of Cu filler is optimized to be 50% to achieve the lowest thermal resistance.
As one of the promising lead-free interconnection materials, electrically conductive adhesive (ECA) has made considerable advances in recent years. Compared to metal solder, ECAs offer numerous advantages, such as environmental friendliness (elimination of lead usage and flux cleaning), mild processing conditions, fewer processing steps (reducing processing cost), low stress on the substrates and...
The fracture responses of interfaces under either monotonic or fatigue loading conditions were investigated by using double cantilever beam (DCB) tests. The tests were performed using a custom-developed micro-tester. The applied load vs. interfacial crack opening relationship obtained from the DCB experiment was analyzed by using a beam on elastic foundation-based closed-form expression for determining...
This paper addresses the potential of molecular dynamics simulation for structure-property correlations in epoxy-resins. This is an important topic within a multi-scale framework to lifetime prediction in electronic packaging. For that purpose, epoxy-resins with small systematic variations in chemical structure have been synthesised and then characterised by various thermo-mechanical testing methods...
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