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A finite element analysis of the electromigration process in metal interconnects can now be performed using the ANSYS program. The analysis is based on the model that includes all the driving forces of electromigration—diffusion gradient, electric current, stress, and temperature gradients. The electromigration model is implemented in the framework of 2-D and 3-D coupled-field elements. Diffusion,...
This paper studies how the underfill with viscoelastic properties impacts the thermal mechanical reliability of a 3D-TSV package system. The Williams-Landel-Ferry equation and the relaxation modulus function in Prony series are used to characterize the viscoelasticity that is both temperature-dependent and time-dependent. The finite element model subjected to a thermal cycle consists of a four-layer...
As the demand grows for multiple functionality and high density, the reliability of plated through hole (PTH) becomes a concern because of the difficulty in small window plating. Choosing a favorable stress-strain model is an important part of PTH's reliability assessment. In this paper, the stress-strain model of Mirman and enhanced IPC (Association Connecting Electronics Industries) are considered...
An electro-thermo coupling finite element model for lead free Sn4.0Ag0.5Cu (SAC405) solder ball is developed to investigate the electromigration and electro-thermo-mechanical effects on electronic packaging in the present paper. SAC405 alloy solder ball are commonly used on BGA package and POP package. In this research, a single solder ball (bump) used on flip chip package is established to evaluate...
In this paper, finite element analysis (FEA) was used to evaluate the stress distribution on quad flat no-lead (QFN) packages. Different models were established, including moisture diffusion, thermo-mechanical stress, hygro-mechanical stress and hygro-thermo-mechanical stress models. The transient moisture absorption and desorption analysis were performed to estimate the package moisture distribution...
The reliability of micro electromechanical systems depends directly on the mechanical behavior of microstructures and their performances are strongly associated with a good knowledge of materials mechanical properties that compose them. Thus, it is important to precisely determine these properties. There are various methods for micro-materials' characterization. In this work, we are interested in...
As far as components with flip chip interconnects are concerned, one of the popular packaging solutions available in the market is thermally enhanced flip chip ball grid array (TEFCBGA) packages, which target mid to high performance applications. Traditional as it may be, the development of a reliable TEFCBGA package is still a very challenging task. The demands for high electrical performance with...
Electronic package devices often endure a substantial number of thermal loading during working. Due to the mismatch of the materials' CTE, the thermal stress can accumulate in the device's interior, which would cause device failure such as die crack, warpage and so on. Especially for the popular multi-chip stacked package, single-chip requires thinner, the tensile strength of chip becomes very small...
PbSnAg solder was widely used in die attachment for high power chip packaging, and the thermal-mechanical reliability of PbSnAg solder layer is a key factor to evaluate the quality of high power devices packaging. Viscoplastic finite-element simulation methodologies were utilized to predict Pb92.5Sn5Ag2.5 solder joint reliability for die attachment under accelerated temperature cycling conditions...
First, the seal reliability function of the O-ring, that is the maximum contact stress between O-ring and plunger must be greater than the fluid pressure, is established, then on the basis of the nonlinear constitutive equation Mooney-Rivlin of rubber material, the finite element model of the O-ring is built using commercial software ABAQUS, according to the finite element model, the distribution...
Moisture properties such as moisture diffusivity and hygroscopic swelling have been carefully investigated for polymeric materials used on the MEMS-based pressure sensor. An improved TMA/TGA integrated method is used to characterize the hygroscopic swelling property. An analytical moisture diffusion solution is proposed to determine the moisture distribution and consequent hygroscopic induced strain...
Chip-Package interaction (CPI) has drawn much attention for very low-k (VLK) packaging technology development, especially as the electronic industry is moving from SnPb solder to lead-free solder. In this study, a multi-level finite element model is used to optimize the interconnect scheme from a packaging reliability point of view. Factors including top metal (or SiO2) thickness, passivation dielectric...
With the increased complexity of SiP (system in package), Finite Element simulations take an important role in predicting the thermo-mechanical package reliability. Failures in flip chip packages such as die cracking and fatigue of solder bumps are specially the result of the mismatch in thermal expansion coefficients between die and the substrate. In some packages, we use an underfill to improve...
Four process parameters including, the pad length, the pad width, the stencil thickness and the stand-off, are chosen as four control factors, and by using an L25(56) orthogonal array, the no-fillet chip component solder joints shapes with 25 different process parameters combinations are established. And then all the shape prediction models of the 25 solder joints are built through the Surface Evolver...
The study of low-k TDDB line space scaling is important for assuring robust reliability for new technologies. Although spacing effects due to line edge roughness (LER) on low-k TDDB lifetime were reported previously (Chen et al., 2007; Lloyd et al., 2007; Kim et al., 2007), there has been a lack of an analytical model with which to link line edge roughness to experimental TDDB data in a simple quantitative...
This paper devotes to the fatigue damage analysis of a solenoid tube under vibration-induced fatigue stresses and is concerned with the estimation of tube reliability from variable amplitude stress histories in the time domain. The complete procedure of reliability assessments for the tube fatigue failure has been presented in this paper. The fatigue strength of the tube material was represented by...
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